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XCZU5EG-2SFVC784I
IC SOC CORTEX-A53 784FCBGA
- Fabricante
- Mfr. Parte #XCZU5EG-2SFVC784I
- Paquete FBGA-784
- Hoja de datos
- En stock5121
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Especificaciones
| Package | Tray |
| Series | Zynq® UltraScale+™ MPSoC EG |
| ProductStatus | Active |
| Architecture | MCU, FPGA |
| CoreProcessor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAMSize | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| PrimaryAttributes | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 784-BFBGA, FCBGA |
Descripción general
Description
Key specifications include 5.5 million system logic cells, 120 DSP slices, and 4.9 MB of block RAM. The device supports various connectivity options such as PCIe, USB, and Ethernet, making it suitable for applications in industrial automation, automotive, and communications.
The XCZU5EG-2SFVC784I operates in a compact BGA package, facilitating efficient thermal management and space utilization in embedded systems. Its programmable logic allows for custom hardware acceleration and real-time processing, making it ideal for high-performance computing tasks. Overall, this device combines flexibility and performance, catering to diverse application needs in modern embedded systems.
Features
Key features include:
1. Processing System: Quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 for efficient application processing and real-time control.
2. FPGA Fabric: 28nm technology with up to 125K logic cells, enabling custom hardware acceleration.
3. Memory Interfaces: Supports DDR4/DDR3L memory, with up to 8GB DDR4.
4. Connectivity: Multiple high-speed interfaces including PCIe, USB, and Gigabit Ethernet.
5. DSP Slices: Integrated DSP slices for efficient signal processing tasks.
6. Security: Built-in hardware security features for secure boot and data protection.
7. Power Efficiency: Designed for low power consumption, suitable for embedded applications.
This device is ideal for applications in automotive, industrial, and communications sectors, providing flexibility and high performance.
Package
Pinout
The pin functions include various I/O capabilities such as GPIO, high-speed transceivers, and power supply pins. The device supports multiple interfaces, including USB, Ethernet, and various memory interfaces, allowing for versatile connectivity and communication in embedded systems.
For detailed pin assignments and specific function mapping, refer to the official Xilinx documentation or datasheet for the XCZU5EG-2SFVC784I.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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