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XCZU4EG-2FBVB900I
IC SOC CORTEX-A53 900FCBGA
- Fabricante
- Mfr. Parte #XCZU4EG-2FBVB900I
- Paquete FBGA-900
- Hoja de datos
- En stock4379
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Especificaciones
| Package | Tray |
| Series | Zynq® UltraScale+™ MPSoC EG |
| ProductStatus | Active |
| Architecture | MCU, FPGA |
| CoreProcessor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAMSize | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| PrimaryAttributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 900-BBGA, FCBGA |
Descripción general
Description
Key features include:
- FPGA Fabric: A significant amount of programmable logic for custom hardware acceleration.
- ARM Cortex-A53: 64-bit application processing with high performance.
- Cortex-R5: Dedicated real-time processing for time-sensitive tasks.
- I/O Flexibility: Multiple I/O options for connecting with various peripherals.
- Memory Interfaces: Support for DDR4 and other memory types for enhanced data processing.
The XCZU4EG-2FBVB900I offers scalability, efficiency, and a combination of hardware and software programmability, making it ideal for developing complex systems that require both high computational power and real-time performance.
Features
1. Architecture: Combines a multi-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, enabling both high-performance and real-time processing capabilities.
2. FPGA Fabric: Includes a significant amount of programmable logic (PL) resources, offering flexibility for custom hardware acceleration.
3. Processing System (PS): Supports advanced interfaces such as USB 3.0, PCIe Gen3, and Gigabit Ethernet, facilitating high-speed communication.
4. Memory Support: Equipped with DDR4 memory interfaces, supporting high bandwidth and low latency.
5. Power Efficiency: Designed for low power consumption while maintaining performance, suitable for embedded applications.
6. Security Features: Incorporates hardware-based security features to enhance system integrity.
Overall, the XCZU4EG-2FBVB900I is ideal for applications in automotive, industrial, and telecommunications that require a balance of processing power and programmable logic.
Package
Pinout
The functions of the pins include various I/O capabilities, power supply, ground connections, configuration interfaces, and dedicated pins for high-speed communication protocols such as PCIe, UART, I2C, SPI, and GPIO. The chip supports multiple voltage levels and can be configured for various applications, including communications, automotive, and industrial control systems.
For detailed pin assignments and functionalities, refer to the device's documentation provided by Xilinx.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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