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XCZU4CG-1FBVB900E
IC SOC CORTEX-A53 900FCBGA
- Fabricante
- Mfr. Parte #XCZU4CG-1FBVB900E
- Paquete
- Hoja de datos
- En stock8462
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Especificaciones
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
| Base Product Number | XCZU4 |
Descripción general
Description
The XCZU4CG-1FBVB900E is optimized for low power consumption while delivering high performance for compute-intensive tasks. Its programmable logic allows users to customize hardware acceleration for specific applications, enhancing overall efficiency. The device is housed in a compact BGA package, making it ideal for space-constrained environments. With extensive development tools and a robust ecosystem, including the Vitis and Vivado Design Suites, developers can quickly design and deploy applications tailored to their needs.
Features
1. Processing System: Quad-core ARM Cortex-A53 (up to 1 GHz) for high-performance applications, and dual-core Cortex-R5 for real-time tasks.
2. FPGA Fabric: Offers programmable logic with around 4,680 LUTs, enabling custom hardware acceleration.
3. Memory Interface: Supports DDR4/DDR3 memory interfaces, enhancing data throughput.
4. Connectivity: Includes high-speed transceivers (up to 6.6 Gbps), enabling various communication protocols.
5. I/O Capabilities: Multiple GPIO and peripheral interfaces for extensive connectivity.
6. Power Efficiency: Designed for low power consumption while maintaining high performance.
7. Integrated Features: Contains hardware security features and support for industrial applications.
This combination of processing power and programmable logic makes it suitable for applications in automotive, industrial, and communication systems.
Package
Pinout
The pin functions include:
1. Power Supply Pins: For powering the device (VCC and ground).
2. Configuration Pins: For loading the FPGA configuration.
3. I/O Pins: General-purpose I/O for interfacing with external devices.
4. High-Speed Transceivers: For high-speed data communication.
5. Clock and Reset Pins: For timing and initialization.
This versatile architecture supports various applications including embedded systems, automotive, and digital signal processing.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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