XCZU3EG-2SFVC784I

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XCZU3EG-2SFVC784I

IC SOC CORTEX-A53 784FCBGA

  • Fabricante
  • Mfr. Parte #XCZU3EG-2SFVC784I
  • Paquete FBGA-784
  • Hoja de datos
  • En stock4669

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Especificaciones

Package Tray
Series Zynq® UltraScale+™ MPSoC EG
ProductStatus Active
Architecture MCU, FPGA
CoreProcessor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAMSize 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
PrimaryAttributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 784-BFBGA, FCBGA

Descripción general

Description

The XCZU3EG-2SFVC784I is a System on Chip (SoC) from Xilinx's Zynq UltraScale+ family, combining a powerful ARM-based processing system with programmable logic. It features a dual-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and an integrated FPGA fabric, allowing for high-performance computing and flexibility in hardware acceleration.
Key specifications include 1 GB of DDR4 memory support, 28nm technology for improved power efficiency, and abundant I/O options through its 784-ball FCBGA package. The architecture supports various applications, including embedded systems, automotive, industrial automation, and telecommunications.
This SoC is suitable for designs requiring a combination of high processing power and customizable hardware, enabling designers to tailor solutions to specific requirements while leveraging the benefits of both software and hardware programmability. Its extensive ecosystem and support tools enhance development efficiency, making it a popular choice for engineers.

Features

The XCZU3EG-2SFVC784I is a member of the Xilinx Zynq UltraScale+ MPSoC family. It integrates a dual-core ARM Cortex-A53 processor with a real-time ARM Cortex-R5 processor, combined with programmable logic (FPGA capabilities). Key features include:
- Processing System: Dual ARM Cortex-A53 (64-bit) with up to 1 GHz and a dual ARM Cortex-R5 (32-bit) for real-time processing.
- FPGA Logic: 85K logic cells, offering extensive programmable resources for custom hardware acceleration.
- Memory Interfaces: Supports DDR4, LPDDR4, and DDR3 memory interfaces with multiple controllers.
- Communication Interfaces: Includes support for PCIe, USB, Ethernet (with high-speed serial transceivers), and GPIOs.
- Embedded DSP: Contains DSP slices for efficient signal processing tasks.
- Power Management: Advanced power management features for efficient operation.
This device is suitable for a variety of applications, including automotive, industrial automation, and telecommunications, due to its high performance, flexibility, and integration capabilities.

Package

The XCZU3EG-2SFVC784I is a System on Chip (SoC) from Xilinx's Zynq UltraScale+ series, housed in a 784-ball FCLGA (Fine-pitch Ball Grid Array) package. This package type allows for a compact design with efficient thermal management and electrical performance.

Pinout

The XCZU3EG-2SFVC784I is a member of the Xilinx Zynq UltraScale+ MPSoC family. It features a pin count of 784 pins. This device integrates both a processing system and programmable logic within a single chip, which allows for high flexibility in design.
The functional features include a dual-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and a programmable logic section using FPGA fabric. Additionally, it supports various I/O standards and interfaces, including USB, Ethernet, and PCIe. The device is designed for applications requiring high performance and efficiency, suitable for industries such as automotive, telecommunications, and industrial automation.

Manufacturer

The XCZU3EG-2SFVC784I is manufactured by Xilinx, Inc., which is a leading company in the field of programmable logic devices. Xilinx specializes in the design and production of Field Programmable Gate Arrays (FPGAs), System-on-Chip (SoC) devices, and Adaptive Compute Acceleration Platforms (ACAPs). Xilinx is known for its innovative solutions that enable engineers and developers to create highly customizable hardware for various applications, including telecommunications, automotive, industrial automation, and data centers. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities in the semiconductor industry.

Application

The XCZU3EG-2SFVC784I is a versatile FPGA from Xilinx's Zynq UltraScale+ series, commonly used in applications such as industrial automation, automotive systems, telecommunications, medical devices, and edge computing. Its combination of programmable logic and ARM processing capabilities enables real-time data processing, complex algorithm execution, and system integration in environments requiring high performance and efficiency.

Equivalent

The XCZU3EG-2SFVC784I is part of Xilinx's Zynq UltraScale+ MPSoC family. Equivalent products include the XCZU3EG-2SFVC784E, XCZU3EG-2SFVC784C, and other Zynq UltraScale+ MPSoCs with similar performance and specifications, such as the XCZU4EG and XCZU5EG, depending on required resources. Always verify specific feature requirements for exact equivalence.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

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