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XCZU3CG-2SFVC784E
IC SOC CORTEX-A53 784FCBGA
- Fabricante
- Mfr. Parte #XCZU3CG-2SFVC784E
- Paquete FBGA-784
- Hoja de datos
- En stock4016
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Especificaciones
| Package | Bulk |
| Series | Zynq® UltraScale+™ MPSoC CG |
| ProductStatus | Active |
| Architecture | MCU, FPGA |
| CoreProcessor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| RAMSize | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 1.3GHz |
| PrimaryAttributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| OperatingTemperature | 0°C ~ 100°C (TJ) |
| Package/Case | 784-BFBGA, FCBGA |
Descripción general
Description
The “-2” indicates the speed grade, while “SFVC784E” represents the package type and pin count, specifically a 784-pin FCLGA. The device supports various I/O standards and high-speed interfaces, including PCIe and Ethernet, enabling connectivity in complex systems. Designed for efficiency, it also offers dynamic power management features, making it suitable for power-sensitive applications. Overall, the XCZU3CG-2SFVC784E is ideal for developers looking to leverage both software programmability and hardware acceleration in their designs.
Features
1. Processing System: 4x Cortex-A53 for high-performance applications and 2x Cortex-R5 for real-time processing.
2. FPGA Fabric: Configurable logic resources, enabling custom hardware acceleration and parallel processing.
3. Memory Interface: Supports DDR4 and LPDDR4 memory, enhancing bandwidth and performance.
4. I/O Options: A variety of high-speed I/O interfaces, including PCIe, USB, and Ethernet.
5. Connectivity: Integrated programmable logic for flexible interfacing and communication protocols.
6. Power Efficiency: Designed for low power consumption while delivering high performance.
7. Security Features: Includes hardware security features for data protection and secure boot.
These characteristics make the XCZU3CG suitable for applications in industrial automation, automotive, telecommunications, and more.
Package
Pinout
In terms of functionality, this device integrates a dual-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and a programmable logic (FPGA) section. The Zynq UltraScale+ architecture allows for a combination of software and hardware processing, enabling applications in areas such as embedded systems, automotive, industrial, and telecommunications.
Key features include support for high-speed serial connectivity, multiple I/O standards, and significant on-chip memory, along with advanced power management capabilities. This versatility makes it suitable for a wide range of applications requiring both processing power and custom hardware acceleration.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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