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XCZU19EG-2FFVB1517I
IC SOC CORTEX-A53 1517FCBGA
- Fabricante
- Mfr. Parte #XCZU19EG-2FFVB1517I
- Paquete
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Especificaciones
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 1517-BBGA, FCBGA |
| Supplier Device Package | 1517-FCBGA (40x40) |
| Base Product Number | XCZU19 |
Descripción general
Description
Key features include:
- FPGA Fabric: A large amount of programmable logic provides user-defined hardware acceleration capabilities.
- Memory Interface: Supports various memory types, enhancing data processing speed.
- Connectivity: Includes multiple high-speed interfaces such as PCIe, USB, and Ethernet, facilitating extensive communication options.
- Power Efficiency: Designed for low power consumption while maintaining high performance, making it suitable for embedded applications in industrial, automotive, and telecommunications sectors.
The XCZU19EG-2FFVB1517I is ideal for applications requiring high computational power combined with customizable hardware logic, enabling efficient execution of complex tasks.
Features
1. Processing: Quad-core ARM Cortex-A53 (64-bit) and dual-core ARM Cortex-R5 for real-time processing.
2. FPGA Fabric: Integrated programmable logic with a significant number of configurable logic blocks (CLBs) for custom digital design.
3. DSP Slices: High-performance DSP slices for signal processing applications.
4. Memory: Supports DDR4 memory interfaces, enabling high bandwidth memory access.
5. I/O: Multiple high-speed I/O interfaces including PCIe, SATA, and USB for connectivity.
6. Power Efficiency: Designed for low power consumption, making it suitable for embedded applications.
7. Security: Built-in security features for data protection and secure boot.
This SoC is ideal for applications in automotive, industrial, and communications sectors, providing a powerful platform for deploying complex algorithms and real-time processing tasks.
Package
Pinout
The functions of the pins include a variety of digital I/O capabilities, power supply pins, and dedicated interfaces such as PCIe, Ethernet, and USB. It also supports high-speed transceivers, LVDS, and multiple general-purpose I/O (GPIO) configurations. The design is optimized for applications in communications, automotive, industrial, and aerospace sectors, providing flexibility for implementing custom logic alongside powerful processing capabilities.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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