XCZU15EG-1FFVC900E

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XCZU15EG-1FFVC900E

IC SOC CORTEX-A53 900FCBGA

  • Fabricante
  • Mfr. Parte #XCZU15EG-1FFVC900E
  • Paquete FBGA-900
  • Hoja de datos
  • En stock7027

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Especificaciones

Package Tray
Series Zynq® UltraScale+™ MPSoC EG
ProductStatus Active
Architecture MCU, FPGA
CoreProcessor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAMSize 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
PrimaryAttributes Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
OperatingTemperature 0°C ~ 100°C (TJ)
Package/Case 900-BBGA, FCBGA

Descripción general

Description

The XCZU15EG-1FFVC900E is a member of Xilinx's Zynq UltraScale+ MPSoC family, which combines a powerful ARM Cortex-A53 quad-core processor with a dual-core Cortex-R5 real-time processor, alongside programmable FPGA resources. This SoC is designed for high-performance applications requiring advanced processing capabilities, such as embedded systems, automotive, industrial automation, and video processing.
Key features include:
- FPGA Fabric: Offers extensive programmable logic resources, enabling custom hardware acceleration.
- High-Speed Interfaces: Supports interfaces like PCIe, USB, and Ethernet for robust connectivity.
- Memory Support: Compatible with multiple memory types, enhancing data handling capabilities.
- Power Efficiency: Designed to balance performance with power consumption, suitable for resource-constrained environments.
- Versatility: Ideal for applications in AI, machine learning, and complex algorithms due to its heterogeneous architecture.
Overall, the XCZU15EG-1FFVC900E is a versatile solution for developers seeking to leverage both processing and hardware customization in their designs.

Features

The XCZU15EG-1FFVC900E is a member of Xilinx's Zynq UltraScale+ MPSoC family, which combines a powerful ARM-based processing system with FPGA fabric. Key features include:
1. Processing System: It incorporates a quad-core ARM Cortex-A53 and a dual-core Cortex-R5, enabling high-performance and real-time processing.
2. FPGA Fabric: Offers a large number of programmable logic resources, including 15,000 LUTs, which allow for custom hardware acceleration.
3. Memory Interfaces: Supports multiple memory interfaces, including DDR4, enabling high bandwidth for data-intensive applications.
4. I/O Capabilities: Features various I/O options, including PCIe, SATA, and USB, providing flexibility for connectivity.
5. High-Speed Transceivers: Equipped with high-speed transceivers for advanced communication protocols.
6. Security Features: Provides hardware-based security features, such as secure boot and encrypted bitstreams.
This combination makes the XCZU15EG-1FFVC900E suitable for applications in automotive, industrial, and communications sectors.

Package

The XCZU15EG-1FFVC900E is packaged in a FFG900 (Fine Pitch Flip Chip) package type, which features a 900-ball configuration for high-density interconnection and efficient thermal performance, suitable for advanced applications in FPGA designs.

Pinout

The XCZU15EG-1FFVC900E is a part of the Xilinx Zynq UltraScale+ MPSoC family. It features a pin count of 900. The device integrates a dual-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and programmable logic (FPGA) resources.
The key functions of the XCZU15EG include advanced processing capabilities for embedded systems, high-performance data processing, and extensive connectivity options. It supports various interfaces such as Gigabit Ethernet, USB, and PCIe, making it suitable for applications in telecommunications, automotive, industrial, and aerospace sectors. The programmable logic allows for custom hardware acceleration and the implementation of complex algorithms.

Manufacturer

The XCZU15EG-1FFVC900E is manufactured by Xilinx, Inc., which is a leading American technology company specializing in the design and development of programmable logic devices, including field-programmable gate arrays (FPGAs), system-on-chips (SoCs), and adaptive computing solutions. Founded in 1984, Xilinx is known for its innovative approach to integrated circuits that allows customers to customize applications for a wide range of industries, including telecommunications, automotive, aerospace, and industrial automation. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further expanding its capabilities in the semiconductor industry.

Application

The XCZU15EG-1FFVC900E is a versatile FPGA from Xilinx's Zynq UltraScale+ series, commonly used in applications such as industrial automation, automotive systems, high-performance computing, video processing, and telecommunications. Its integration of a multi-core ARM processor with programmable logic allows for flexibility in designing complex algorithms, real-time processing, and efficient data handling in edge computing and IoT solutions.

Equivalent

The XCZU15EG-1FFVC900E is a part of the Xilinx Zynq UltraScale+ family. Equivalent products include XCZU15EG-2FFVC900E (different speed grade) and other Zynq UltraScale+ devices with similar resources, such as XCZU19EG and XCZU13EG, depending on specific requirements like I/O count, logic cells, and DSP slices. Always confirm compatibility based on your application needs.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

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