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XCVU9P-3FLGB2104E
IC FPGA 702 I/O 2104FCBGA
- Fabricante
- Mfr. Parte #XCVU9P-3FLGB2104E
- Paquete
- Hoja de datos
- En stock8979
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Especificaciones
| Series | Virtex® UltraScale+™ |
| Part Status | Active |
| Base Product Number | XCVU9 |
| DigiKey Programmable | Not Verified |
| Number of LABs/CLBs | 147780 |
| Number of Logic Elements/Cells | 2586150 |
| Total RAM Bits | 391168000 |
| Number of I/O | 702 |
| Voltage - Supply | 0.873V ~ 0.927V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package | 2104-BBGA, FCBGA |
| Supplier Device Package | 2104-FCBGA (47.5x47.5) |
| Packaging | Tray |
Descripción general
Description
Key characteristics include low latency, high throughput, and support for various protocols and standards, making it ideal for telecommunications, aerospace, defense, and data center applications. The device operates at a low power profile while maintaining robust performance metrics, leveraging advanced fabrication technologies.
Its architecture supports a wide range of development tools, enabling designers to implement custom hardware solutions quickly. The XCVU9P-3FLGB2104E is an excellent choice for engineers needing a powerful, versatile FPGA to address complex design challenges.
Features
1. High Capacity: It supports up to 9 million system logic cells, enabling complex designs.
2. Performance: Offers high-speed I/O capabilities with support for various standards, including PCIe Gen4, and 400G Ethernet.
3. Memory: Includes significant on-chip RAM and support for external memory interfaces.
4. Power Efficiency: Designed for lower power consumption compared to previous generations while maintaining high performance.
5. Advanced DSP: Features numerous DSP slices for efficient signal processing tasks.
6. Connectivity: Provides extensive connectivity options, including support for high-speed transceivers.
7. Configuration Flexibility: Capable of being programmed and reconfigured for different applications.
This FPGA is suitable for data centers, telecommunications, and high-performance computing tasks where flexibility and speed are crucial.
Package
Pinout
The pins serve various functions, including:
1. I/O Pins: Configurable input/output pins for interfacing with external devices.
2. Power Pins: Supply pins for core and I/O voltage levels.
3. Ground Pins: Common return path for electrical current.
4. Configuration Pins: Used for programming the FPGA and managing its configuration.
5. Clock Pins: Dedicated pins for clock signals.
6. High-Speed Serial Transceivers: For high-bandwidth data communication.
7. JTAG Pins: For debugging and programming.
The pin arrangement and specific functions can be referenced in the Xilinx documentation for detailed electrical and functional specifications.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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