XCVU9P-3FLGB2104E

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XCVU9P-3FLGB2104E

IC FPGA 702 I/O 2104FCBGA

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  • Mfr. Parte #XCVU9P-3FLGB2104E
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Especificaciones

Series Virtex® UltraScale+™
Part Status Active
Base Product Number XCVU9
DigiKey Programmable Not Verified
Number of LABs/CLBs 147780
Number of Logic Elements/Cells 2586150
Total RAM Bits 391168000
Number of I/O 702
Voltage - Supply 0.873V ~ 0.927V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 100°C (TJ)
Package 2104-BBGA, FCBGA
Supplier Device Package 2104-FCBGA (47.5x47.5)
Packaging Tray

Descripción general

Description

The XCVU9P-3FLGB2104E is a high-performance field-programmable gate array (FPGA) from Xilinx's Virtex UltraScale+ series. It is designed for advanced applications requiring significant processing power, flexibility, and high-speed connectivity. Featuring a large number of logic cells, DSP slices, and high-bandwidth memory interfaces, this FPGA is suitable for data-intensive tasks such as real-time processing, machine learning, and high-frequency trading.
Key characteristics include low latency, high throughput, and support for various protocols and standards, making it ideal for telecommunications, aerospace, defense, and data center applications. The device operates at a low power profile while maintaining robust performance metrics, leveraging advanced fabrication technologies.
Its architecture supports a wide range of development tools, enabling designers to implement custom hardware solutions quickly. The XCVU9P-3FLGB2104E is an excellent choice for engineers needing a powerful, versatile FPGA to address complex design challenges.

Features

The XCVU9P-3FLGB2104E is part of Xilinx's UltraScale+ FPGA family, designed for high performance and versatility in various applications. Key features include:
1. High Capacity: It supports up to 9 million system logic cells, enabling complex designs.
2. Performance: Offers high-speed I/O capabilities with support for various standards, including PCIe Gen4, and 400G Ethernet.
3. Memory: Includes significant on-chip RAM and support for external memory interfaces.
4. Power Efficiency: Designed for lower power consumption compared to previous generations while maintaining high performance.
5. Advanced DSP: Features numerous DSP slices for efficient signal processing tasks.
6. Connectivity: Provides extensive connectivity options, including support for high-speed transceivers.
7. Configuration Flexibility: Capable of being programmed and reconfigured for different applications.
This FPGA is suitable for data centers, telecommunications, and high-performance computing tasks where flexibility and speed are crucial.

Package

The XCVU9P-3FLGB2104E is packaged in a FFG (Fine Pitch Ball Grid Array) package type, specifically designed for high-density applications. It features a ball grid layout for efficient heat dissipation and electrical performance.

Pinout

The Xilinx Virtex UltraScale+ FPGA model XCVU9P-3FLGB2104E has a total of 2104 pins. It is part of the Virtex UltraScale+ family, which is designed for high-performance applications in areas such as data center, networking, and machine learning.
The pins serve various functions, including:
1. I/O Pins: Configurable input/output pins for interfacing with external devices.
2. Power Pins: Supply pins for core and I/O voltage levels.
3. Ground Pins: Common return path for electrical current.
4. Configuration Pins: Used for programming the FPGA and managing its configuration.
5. Clock Pins: Dedicated pins for clock signals.
6. High-Speed Serial Transceivers: For high-bandwidth data communication.
7. JTAG Pins: For debugging and programming.
The pin arrangement and specific functions can be referenced in the Xilinx documentation for detailed electrical and functional specifications.

Manufacturer

The XCVU9P-3FLGB2104E is manufactured by Xilinx, Inc., which is a subsidiary of Advanced Micro Devices (AMD) as of 2021. Xilinx is a leading company in the field of programmable logic devices, specializing in field-programmable gate arrays (FPGAs), system-on-chips (SoCs), and adaptive computing solutions. Founded in 1984, Xilinx pioneered the FPGA technology and has been instrumental in its applications across various industries, including telecommunications, automotive, aerospace, and data centers. The company focuses on providing high-performance, flexible hardware solutions that enable customers to accelerate their design processes and innovate in their respective fields.

Application

The XCVU9P-3FLGB2104E is a high-performance FPGA from the Xilinx Virtex UltraScale+ series. It is commonly used in areas such as data center acceleration, high-frequency trading, machine learning inference, video processing, and telecommunications. Its capabilities enable applications in software-defined networking, advanced imaging, and real-time analytics, making it suitable for tasks requiring high bandwidth and low latency.

Equivalent

The XCVU9P-3FLGB2104E is a versatile FPGA from Xilinx's Virtex UltraScale+ series. Equivalent products include the XCVU9P-3FLG2104C, which offers similar performance with minor differences in speed grade, and the Intel Stratix 10 series, such as the 10SX280N, which provides comparable capabilities. Always verify specific requirements, such as I/O configurations and power consumption, when considering alternatives.

Envío

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DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

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