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XCVU9P-2FLGA2104I
IC FPGA 416 I/O 2104FCBGA
- Fabricante
- Mfr. Parte #XCVU9P-2FLGA2104I
- Paquete FBGA-2104
- Hoja de datos
- En stock6090
100% original & Nuevo
24 horas listos para el envío
Garantía de 365 días
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Especificaciones
| Package | Tray |
| Series | Virtex® UltraScale+™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 147780 |
| NumberofLogicElements/Cells | 2586150 |
| TotalRAMBits | 391168000 |
| NumberofI/O | 416 |
| Voltage-Supply | 0.825V ~ 0.876V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 2104-BBGA, FCBGA |
Descripción general
Description
Key specifications include a maximum capacity of 9 million logic cells, multiple DSP slices for efficient signal processing, and support for a range of connectivity options such as PCIe and Ethernet. The FLGA2104 package indicates a fine-pitch ball grid array, which helps in achieving high-density designs.
The device offers flexibility through programmable architecture, allowing for customization in various applications, including AI inference, video processing, and networking. Additionally, the UltraScale+ architecture enhances performance and power efficiency, providing a balance of speed and functionality for demanding tasks. Overall, the XCVU9P-2FLGA2104I is a robust solution for engineers looking to implement cutting-edge hardware solutions.
Features
1. Logic Cells: It offers a substantial number of logic cells for complex applications.
2. DSP Slices: Equipped with numerous DSP slices for high-speed digital signal processing.
3. Memory: Supports large amounts of on-chip memory, enabling efficient data handling.
4. High-Speed I/O: Features multiple high-speed serial transceivers, facilitating fast data communication.
5. Power Efficiency: Designed for lower power consumption while maintaining performance.
6. Scalability: Suitable for various applications, from telecommunications to data centers and automotive systems.
7. Advanced Configuration: Supports various design methodologies including high-level synthesis and hardware/software co-design.
Overall, the XCVU9P-2FLGA2104I is ideal for applications requiring extensive processing power and flexibility, making it a popular choice in modern electronic designs.
Package
Pinout
The pins serve various functions, including:
1. I/O Pins: For general-purpose input/output operations, allowing interfacing with external devices.
2. Power Pins: Supply power to the FPGA core and I/O banks.
3. Clock Pins: Dedicated pins for clock signals to synchronize operations.
4. Configuration Pins: For programming and configuring the FPGA.
5. Ground Pins: To provide a stable reference voltage and reduce noise.
The XCVU9P model includes advanced features such as high-speed serial transceivers and programmable logic, making it suitable for demanding applications that require significant processing capabilities and high bandwidth.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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