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XCVU9P-2FLGA2104E
IC FPGA 832 I/O 2104FCBGA
- Fabricante
- Mfr. Parte #XCVU9P-2FLGA2104E
- Paquete
- Hoja de datos
- En stock9314
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Especificaciones
| Series | Virtex® UltraScale+™ |
| Part Status | Active |
| DigiKey Programmable | Not Verified |
| Number of Logic Elements/Cells | 2586150 |
| Total RAM Bits | 391168000 |
| Number of I/O | 832 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 2104-BBGA, FCBGA |
| Supplier Device Package | 2104-FCBGA (47.5x47.5) |
| Base Product Number | XCVU9 |
| Number of LABs/CLBs | 147780 |
Descripción general
Description
This FPGA features a significant number of logic cells, high-speed transceivers, and dedicated resources for AI, machine learning, and data processing tasks. Its architecture supports dynamic reconfiguration, allowing for flexibility in application deployment. The FLGA2104E package indicates the type and dimensions of the chip, facilitating integration into various systems.
The XCVU9P is ideal for applications in data centers, telecommunications, automotive, and more, providing the necessary performance and scalability to meet demanding workloads.
Features
1. Architecture: Utilizes a 16nm FinFET process technology, enhancing power efficiency and performance.
2. Logic Cells: Offers a large number of configurable logic blocks, suitable for complex computational tasks.
3. DSP Slices: Includes numerous DSP slices optimized for high-throughput signal processing applications.
4. Memory: Features extensive on-chip memory resources, including Block RAM and UltraRAM, facilitating large data handling.
5. Transceivers: Equipped with high-speed transceivers supporting multi-gigabit data rates, essential for high-performance networking and communications.
6. Power Efficiency: Designed to deliver superior performance-per-watt, making it suitable for power-sensitive applications.
7. Connectivity: Supports multiple I/O standards with a flexible routing architecture, enabling diverse connectivity options.
8. Scalability: Compatible with various development tools and ecosystems, allowing for easy scalability in design.
These features make the XCVU9P ideal for applications in data centers, automotive, aerospace, and telecommunications.
Package
Pinout
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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