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XCVU7P-2FLVA2104I
IC FPGA 832 I/O 2104FCBGA
- Fabricante
- Mfr. Parte #XCVU7P-2FLVA2104I
- Paquete FBGA-2104
- Hoja de datos
- En stock3161
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Especificaciones
| Package | Tray |
| Series | Virtex® UltraScale+™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 98520 |
| NumberofLogicElements/Cells | 1724100 |
| TotalRAMBits | 260812800 |
| NumberofI/O | 832 |
| Voltage-Supply | 0.825V ~ 0.876V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 2104-BBGA, FCBGA |
Descripción general
Description
Key attributes include:
1. Architecture: Built on a 16nm FinFET process, offering improved performance and power efficiency.
2. Logic Resources: Contains a significant number of LUTs (Look-Up Tables), DSP slices, and flip-flops for complex computations.
3. Transceivers: Supports high-speed serial connectivity, often exceeding 28 Gbps, making it suitable for high-bandwidth applications.
4. Memory Interfaces: Includes support for various memory types, enhancing data handling capabilities.
5. Applications: Suited for AI/ML, video processing, and real-time data analytics.
The XCVU7P-2FLVA2104I is ideal for engineers looking for flexibility and scalability in their hardware design.
Features
1. Architecture: Built on the UltraScale+ architecture, offering improved performance and efficiency.
2. Logic Cells: Contains a significant number of configurable logic blocks (CLBs) for diverse design implementations.
3. High-Speed I/O: Supports high-speed transceivers, enabling data rates of up to 28 Gbps, suitable for demanding applications.
4. Memory: Integrated large amounts of block RAM for data storage and processing, enhancing throughput.
5. DSP Slices: Features DSP slices optimized for digital signal processing applications, supporting high-performance arithmetic operations.
6. Power Efficiency: Designed for low power consumption while maintaining high processing capabilities.
7. Flexible Connectivity: Offers a variety of interfaces, including PCIe, Ethernet, and serial protocols, facilitating extensive connectivity options.
8. Design Tools: Compatible with Xilinx's Vivado Design Suite for streamlined design and development processes.
This FPGA is suited for applications in data centers, telecommunications, automotive, and industrial automation.
Package
Pinout
In terms of functionality, this FPGA is designed for high-performance applications, providing advanced capabilities for processing, high-speed I/O, and flexibility in design. It supports various interfaces, such as PCIe, Ethernet, and high-speed serial transceivers, making it suitable for applications in data centers, telecommunications, and embedded systems. The device includes programmable logic, digital signal processing (DSP) slices, and memory resources, enabling efficient implementation of complex algorithms and data handling tasks.
For detailed specifications, refer to the official Xilinx documentation.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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