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XCVU23P-2VSVA1365E
IC FPGA VIRTEX-UP 1365FCBGA
- Fabricante
- Mfr. Parte #XCVU23P-2VSVA1365E
- Paquete
- Hoja de datos
- En stock9278
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Especificaciones
| Series | Virtex® UltraScale+™ |
| Part Status | Active |
| DigiKey Programmable | Not Verified |
| Number of Logic Elements/Cells | 2252250 |
| Total RAM Bits | 77909197 |
| Number of I/O | 364 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 1365-BFBGA, FCBGA |
| Supplier Device Package | 1365-FCBGA (35x35) |
| Number of LABs/CLBs | 128700 |
Descripción general
Description
Key features include a 2.5D architecture, advanced power management, and enhanced connectivity options, making it suitable for various industries, including automotive, aerospace, and data centers. The device operates at high clock speeds and supports a wide range of interfaces, ensuring flexibility and scalability in system design.
The XCVU23P also benefits from Xilinx's Vivado design suite, providing tools and libraries for development and optimization, facilitating rapid prototyping and deployment. Overall, it is an ideal choice for engineers seeking a versatile and powerful solution for complex applications.
Features
1. Logic Resources: 1.5 million system logic cells, providing significant parallel processing capabilities.
2. DSP Slices: Approximately 3,840 DSP slices for high-speed signal processing and math operations.
3. Memory: Up to 70 Mb of integrated block RAM for efficient data storage and retrieval.
4. Transceivers: Up to 32 high-speed transceivers supporting data rates of up to 28.1 Gbps, facilitating high-bandwidth connections.
5. Programmability: Reconfigurable architecture allows customization for various applications in data centers, AI, and embedded systems.
6. Power Efficiency: Advanced power management features help optimize performance per watt.
7. Enhanced Connectivity: Support for multiple interfaces including PCIe, Ethernet, and high-speed serial protocols.
This FPGA is designed for demanding applications requiring high performance, flexibility, and scalability.
Package
Pinout
The primary functions of these pins include:
1. Configurable I/O: These pins can be configured for various I/O standards, enabling connectivity with different types of devices.
2. Power Supply Pins: Dedicated pins for powering the FPGA, including core, I/O, and auxiliary supplies.
3. Clock Pins: For input and output of clock signals, supporting multiple clock management features.
4. Configuration Pins: For loading the FPGA configuration data during startup.
5. Dedicated High-Speed Serial Transceiver Ports: For high-speed communication interfaces.
Overall, the XCVU23P-2VSVA1365E is designed for high-performance applications, offering flexibility in pin configuration to accommodate various design needs.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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