XCVU19P-2FSVA3824E

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XCVU19P-2FSVA3824E

IC FPGA 1976 I/O 3824FCBGA

  • Fabricante
  • Mfr. Parte #XCVU19P-2FSVA3824E
  • Paquete BGA
  • Hoja de datos
  • En stock4934

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Especificaciones

Package Tray
Series Virtex® UltraScale+™
ProductStatus Active
NumberofLABs/CLBs 510720
NumberofLogicElements/Cells 8937600
TotalRAMBits 79586918
NumberofI/O 1976
Voltage-Supply 0.825V ~ 0.876V
MountingType Surface Mount
OperatingTemperature 0°C ~ 100°C (TJ)
Package/Case 3824-BBGA, FCBGA

Descripción general

Description

The XCVU19P-2FSVA3824E is a member of the Xilinx UltraScale+ FPGA family, designed for high-performance applications requiring advanced processing capabilities. It features a large number of configurable logic blocks, extensive DSP slices for efficient signal processing, and high-speed transceivers for data communication. This FPGA is optimized for applications in data centers, telecommunications, and edge computing.
The architecture supports a range of functionalities, including integrated memory, high-bandwidth interfaces, and robust security features. With a maximum of 19 million logic cells, it provides significant parallel processing power, making it suitable for complex algorithms and real-time data processing tasks.
The device utilizes a 16nm FinFET technology, ensuring lower power consumption and high performance. It also supports various design tools and frameworks, facilitating the development of custom hardware solutions. Overall, the XCVU19P-2FSVA3824E is ideal for engineers looking to implement advanced digital solutions in demanding environments.

Features

The XCVU19P-2FSVA3824E is a high-performance FPGA (Field-Programmable Gate Array) from Xilinx's Versal Unified series. Key features include:
1. Architecture: Built on a Versal Adaptive Compute Acceleration Platform (ACAP), integrating programmable logic with software programmability.
2. Processing Engines: Contains a combination of scalar, vector, and matrix processing engines to enhance performance for diverse workloads.
3. High Bandwidth Memory: Supports advanced memory interfaces including DDR4 and HBM (High Bandwidth Memory) for improved data throughput.
4. Connectivity: Offers a variety of connectivity options such as Ethernet, PCIe, and Serial interfaces, facilitating high-speed data transfer.
5. AI/ML Acceleration: Optimized for artificial intelligence and machine learning applications, providing hardware acceleration for inference tasks.
6. Scalability: Features a scalable architecture allowing for efficient deployment in various applications, from data centers to edge computing.
7. Development Tools: Compatible with Xilinx's Vitis and Vivado design environments for streamlined development and integration.
This FPGA is ideal for applications requiring flexibility, high performance, and adaptability, such as telecommunications, automotive, and data processing.

Package

The XCVU19P-2FSVA3824E is packaged in a 3824-pin Flip-Chip Ball Grid Array (FCBGA) format. This package type is designed for high-performance applications, offering excellent thermal and electrical characteristics.

Pinout

The XCVU19P-2FSVA3824E is a high-performance FPGA from Xilinx's Virtex UltraScale+ series. It features a pin count of 3824.
The primary functions of the XCVU19P FPGA include high-speed data processing, advanced signal processing, and complex system integration. It supports a variety of applications such as telecommunications, data centers, and aerospace and defense. The device incorporates numerous programmable logic resources, DSP slices, and memory blocks, along with high-speed transceivers for data communication.
In summary, the XCVU19P-2FSVA3824E has 3824 pins and is designed for high-performance applications requiring flexibility and extensive processing capabilities.

Manufacturer

The XCVU19P-2FSVA3824E is manufactured by Xilinx, a company known for designing and producing Field-Programmable Gate Arrays (FPGAs), System on Chips (SoCs), and adaptive compute acceleration platforms. Xilinx specializes in providing high-performance, reconfigurable computing solutions that are widely used in various industries, including telecommunications, automotive, aerospace, and data centers. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further expanding its portfolio in the semiconductor market.

Application

The XCVU19P-2FSVA3824E is a versatile FPGA from Xilinx, suitable for various application areas, including data center acceleration, high-performance computing, artificial intelligence and machine learning, 5G wireless infrastructure, video processing, and embedded systems. Its high-performance capabilities and flexibility make it ideal for complex algorithms, real-time processing, and custom hardware acceleration in diverse industries.

Equivalent

The XCVU19P-2FSVA3824E is a high-performance FPGA from Xilinx. Equivalent products include the Intel Stratix 10 series, specifically the Stratix 10 GX 2800 or higher models, and other Xilinx UltraScale+ devices like the XCVU19P or XCVU13P, depending on specific requirements such as logic density, I/O capabilities, and intended applications. Always verify compatibility based on performance needs and design specifications.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

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