XCVU13P-2FLGA2577I

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XCVU13P-2FLGA2577I

IC FPGA 448 I/O 2577FCBGA

  • Fabricante
  • Mfr. Parte #XCVU13P-2FLGA2577I
  • Paquete FBGA-2577
  • Hoja de datos
  • En stock4448

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Especificaciones

Package Tray
Series Virtex® UltraScale+™
ProductStatus Active
NumberofLABs/CLBs 216000
NumberofLogicElements/Cells 3780000
TotalRAMBits 514867200
NumberofI/O 448
Voltage-Supply 0.825V ~ 0.876V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 2577-BBGA, FCBGA

Descripción general

Description

The XCVU13P-2FLGA2577I is a high-performance FPGA (Field Programmable Gate Array) from Xilinx's Virtex UltraScale+ family. Designed for demanding applications such as data center acceleration, high-speed networking, and advanced signal processing, it features a large number of configurable logic blocks, DSP slices, and high-speed transceivers. The "13P" indicates a specific configuration of the device, while "FLGA" refers to the flip-chip land grid array package type, which supports high I/O density and efficient thermal management.
With a capacity of 3.8 million logic cells and support for various interfaces, including PCIe and Ethernet, the XCVU13P is suited for complex algorithms and real-time processing. It offers advanced power management features and can be programmed using VHDL, Verilog, or high-level synthesis tools, making it versatile for engineers. Designed for scalability and integration, this FPGA is a key component in modern computing and telecommunications infrastructures.

Features

The XCVU13P-2FLGA2577I is a Field Programmable Gate Array (FPGA) from Xilinx’s Virtex UltraScale+ family. Key features include:
1. Architecture: Utilizes the UltraScale+ architecture for high performance and efficiency.
2. Logic Cells: Contains 1,000,000+ logic cells, supporting complex designs.
3. DSP Slices: Equipped with numerous DSP slices for high-speed arithmetic operations.
4. Memory: Supports multiple types of memory blocks, including Block RAM (BRAM) and UltraRAM.
5. I/O: Offers a diverse set of I/O capabilities, including high-speed transceivers for communication.
6. Power Efficiency: Designed for low power consumption while maintaining high performance.
7. Advanced Features: Supports advanced features like partial reconfiguration and integrated SERDES.
8. Application Areas: Ideal for data center, high-performance computing, and telecommunications applications.
This FPGA is known for its flexibility, scalability, and ability to handle demanding workloads efficiently.

Package

The XCVU13P-2FLGA2577I is packaged in a FFG (Fine-pitch Flip Chip Grid Array) form factor, specifically a 2577-ball configuration. This type of package provides a compact design with high interconnect density, suitable for high-performance applications in FPGA technology.

Pinout

The XCVU13P-2FLGA2577I is a member of the Xilinx Virtex UltraScale+ FPGA family. It features a pin count of 2577 pins. The device is designed for high performance and includes various functionalities such as logic cells, DSP slices, block RAM, and high-speed transceivers.
It supports multiple I/O standards, enabling flexibility in interfacing with different components. The architecture is optimized for demanding applications in fields like telecommunications, data centers, and high-performance computing. The "2" in the designation indicates the speed grade, while "FLGA" refers to its package type, which is a flip-chip ball grid array.
Overall, the XCVU13P-2FLGA2577I is suited for complex digital designs requiring significant processing power and connectivity options.

Manufacturer

The manufacturer of the XCVU13P-2FLGA2577I is Xilinx, Inc., which is now a part of AMD (Advanced Micro Devices, Inc.) following its acquisition in 2022. Xilinx is a leading company in the field of programmable logic devices, focusing on Field-Programmable Gate Arrays (FPGAs), System on Chips (SoCs), and adaptive compute acceleration platforms. The company specializes in providing solutions for various applications, including data centers, automotive, telecommunications, and industrial automation. Their products enable designers to create customized hardware solutions that can be reconfigured to meet specific performance, power, and functionality requirements.

Application

The XCVU13P-2FLGA2577I is a high-performance FPGA from Xilinx, suitable for applications in data centers, high-performance computing, AI and machine learning acceleration, 5G wireless infrastructure, video processing, and real-time analytics. Its capabilities enable optimized processing for complex algorithms and large data throughput across sectors like telecommunications, automotive, aerospace, and industrial automation.

Equivalent

The XCVU13P-2FLGA2577I is a member of the Xilinx Virtex UltraScale+ family. Equivalent products include the XCVU13P-1FLGA2577I (lower speed grade) and products from the Intel Stratix 10 series, such as the Stratix 10 MX or TX, which offer similar capabilities in high-performance FPGAs. Always verify specific requirements like I/O count and power consumption for the best match.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

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