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XCVU13P-2FHGB2104I
IC FPGA 702 I/O 2104FCBGA
- Fabricante
- Mfr. Parte #XCVU13P-2FHGB2104I
- Paquete FBGA-2104
- Hoja de datos
- En stock2098
100% original & Nuevo
24 horas listos para el envío
Garantía de 365 días
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Especificaciones
| Package | Tray |
| Series | Virtex® UltraScale+™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 216000 |
| NumberofLogicElements/Cells | 3780000 |
| TotalRAMBits | 514867200 |
| NumberofI/O | 702 |
| Voltage-Supply | 0.825V ~ 0.876V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 2104-BBGA, FCBGA |
Descripción general
Description
Key features include:
- Logic Cells: A large number of configurable logic cells, enabling complex designs.
- DSP Slices: High-density DSP slices for efficient signal processing.
- Memory: Ample integrated memory resources, including block RAM and UltraRAM.
- Transceivers: High-speed serial transceivers support data rates up to 28 Gbps, ideal for communication applications.
- Power Efficiency: Advanced power management features that optimize performance per watt.
Applications span telecommunications, data centers, machine learning, and automotive systems. The XCVU13P is suitable for demanding tasks requiring both speed and flexibility, making it a crucial component for modern digital designs.
Features
1. Architecture: Utilizes a 16nm FinFET process technology, providing superior power efficiency and performance.
2. Logic Resources: Contains approximately 1.5 million logic cells and 7,000 DSP slices, enabling complex computations and digital signal processing.
3. Memory: Features a large number of block RAMs and UltraRAM for high-speed data storage.
4. I/O Capabilities: Supports numerous high-speed serial transceivers, allowing for versatile connectivity options.
5. Power Efficiency: Designed for low power consumption, suitable for demanding applications in data centers and telecommunications.
6. Integration: Capable of integrating various functions, reducing the need for multiple discrete components.
7. Scalability: Suitable for a wide range of applications, including automotive, aerospace, and machine learning.
This FPGA is ideal for applications requiring high bandwidth, low latency, and efficient processing capabilities.
Package
Pinout
The pin functions include various I/O, power, ground, and configuration interfaces. Specifically, it supports high-speed serial transceivers, general-purpose I/O (GPIO) pins, and dedicated power and ground pins. The device also has specialized pins for clock management, configuration, and JTAG programming.
Overall, the XCVU13P is designed for high-performance applications, providing capabilities for extensive parallel processing, high bandwidth, and complex logic functions.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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