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XCVU13P-2FHGA2104E
IC FPGA 832 I/O 2104FCBGA
- Fabricante
- Mfr. Parte #XCVU13P-2FHGA2104E
- Paquete FBGA-2104
- Hoja de datos
- En stock3879
100% original & Nuevo
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Garantía de 365 días
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Especificaciones
| Package | Tray |
| Series | Virtex® UltraScale+™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 216000 |
| NumberofLogicElements/Cells | 3780000 |
| TotalRAMBits | 514867200 |
| NumberofI/O | 832 |
| Voltage-Supply | 0.825V ~ 0.876V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 100°C (TJ) |
| Package/Case | 2104-BBGA, FCBGA |
Descripción general
Description
Key specifications include:
- Logic Cells: It offers a large number of configurable logic cells, enabling complex designs.
- Memory: The device includes significant on-chip memory resources, enhancing data handling capabilities.
- I/O Capabilities: It supports various high-speed interfaces, allowing for versatile connectivity options.
- Power Efficiency: Designed for low-power operation, it enables high performance with reduced energy consumption.
- 400G Ethernet and PCIe Support: It is well-suited for applications requiring high bandwidth and fast data transfer.
The XCVU13P is particularly suitable for edge computing, AI inference, and large-scale telecom processing. Its programmability allows for customization, making it a popular choice for engineers looking to implement specific functionalities in hardware.
Features
1. Architecture: Utilizes a 16nm FinFET process technology, enabling higher performance and lower power consumption.
2. Logic Cells: Offers up to 1.5 million logic cells, suitable for complex designs and applications.
3. DSP Slices: Includes around 8,000 DSP slices, ideal for signal processing tasks.
4. Memory: Provides extensive on-chip memory options, including block RAM (BRAM) and UltraRAM for enhanced data handling capabilities.
5. I/O: Supports high-speed I/O interfaces, including PCIe Gen4, featuring up to 32 lanes for rapid data transfer.
6. Connectivity: Integrated high-speed transceivers capable of 28 Gbps for reliable communication.
7. Design Flexibility: Supports various design methodologies, including RTL, C/C++, and high-level synthesis (HLS).
8. Power Efficiency: Designed for optimized power management, suitable for both performance-intensive and power-sensitive applications.
Overall, the XCVU13P-2FHGA2104E is engineered for advanced computing tasks in data centers, telecommunications, and industrial applications.
Package
Pinout
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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