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XCVP1502-2MSEVSVA2785
IC VERSAL AI-CORE FPGA 2785BGA
- Fabricante
- Mfr. Parte #XCVP1502-2MSEVSVA2785
- Paquete
- Hoja de datos XCVP1502-2MSEVSVA2785 DataSheet
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Especificaciones
| Series | Versal® Premium |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.4GHz |
| Primary Attributes | Versal™ Premium FPGA, 3.7M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 2785-BFBGA |
| Supplier Device Package | 2785-BGA (50x50) |
Descripción general
Description
Key specifications typically include a high number of logic cells, DSP slices, and memory resources, enabling complex computations and efficient data handling. The device supports various interfaces for connectivity and can be programmed using Xilinx’s Vitis and Vivado design environments.
The XCVP1502-2MSEVSVA2785 is suitable for applications in telecommunications, automotive, and data centers, providing developers with the flexibility and performance needed for next-generation systems. It emphasizes energy efficiency and scalability, making it a powerful choice for diverse application needs.
Features
1. Architecture: It utilizes a heterogeneous architecture combining scalar processors, adaptable hardware, and programmable logic to offer flexibility in processing tasks.
2. Performance: It supports high throughput and low latency, making it suitable for data-intensive applications such as AI, machine learning, and high-speed communications.
3. Connectivity: Equipped with advanced connectivity options, including PCIe, Ethernet, and various serial interfaces, facilitating integration into complex systems.
4. Memory: Supports high-bandwidth memory interfaces to manage data efficiently.
5. Power Efficiency: Designed for power-efficient operation, optimizing performance per watt, which is critical for embedded applications.
6. Scalability: Offers scalability to adapt to various application needs, from edge to data center environments.
This combination of features makes the XCVP1502-2MSEVSVA2785 ideal for a wide range of applications, including automotive, industrial automation, and data analytics.
Package
Pinout
Key functions include support for various I/O standards, programmable logic, and advanced features such as embedded memory blocks and digital signal processing (DSP) slices. The specific model, XCVP1502, is optimized for applications requiring significant logic capacity and high-speed connectivity.
Manufacturer
Application
Equivalent
1. Xilinx Virtex-6: XC6VSX315T
2. Xilinx Kintex-7: XC7K325T
3. Altera Stratix V: 5SGXEA7N2F45C2
4. Lattice ECP5: LFE5U-45F-6MG285C
Always verify compatibility based on specific application requirements and specifications.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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