XCVM1502-1MSEVFVC1760

Las imágenes son solo para referencia

XCVM1502-1MSEVFVC1760

IC VERSALPRIME ACAP FPGA 1760BGA

  • Fabricante
  • Mfr. Parte #XCVM1502-1MSEVFVC1760
  • Paquete
  • Hoja de datos
  • En stock5753

100% original & Nuevo

24 horas listos para el envío

Garantía de 365 días

RFQ y Obtenga más descuentos

Especificaciones

Series Versal™ Prime
Part Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.3GHz
Primary Attributes Versal™ Prime FPGA, 1M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)

Descripción general

Description

"Introduction to XCVM1502-1MSEVFVC1760" likely refers to a specific course, module, or product that is not widely recognized or documented in publicly available resources. To understand its context, you would typically need to refer to the syllabus or documentation provided by the institution or organization offering it. The alphanumeric code could indicate a course number, version, or a specific section relevant to a particular field, such as engineering, computer science, or vocational training. If this is related to a course or product, it's essential to check with the issuing institution, company, or platform for detailed information, including objectives, content, and prerequisites. If you have access to additional context or details, please share them for a more precise response.

Package

The XCVM1502-1MSEVFVC1760 is a type of FPGA package from Xilinx, typically in a VFBGA1760 package format, which indicates a Very Fine Ball Grid Array with 1760 solder balls. This type of package is used for high-performance programmable logic devices and is suitable for applications requiring high-density interconnections and efficient heat dissipation.

Pinout

The XCVM1502-1MSEVFVC1760 is a part of the Xilinx Virtex UltraScale+ FPGA family. It features 1760 pins. These FPGAs are designed for high-performance applications and include a wide range of functionalities, such as high-speed I/O, DSP slices, and configurable logic blocks.
Key functions of this FPGA include:
1. Programmable Logic: Offers a large number of logic cells that can be configured for various digital processing tasks.
2. High-Speed I/O: Supports multiple high-speed communication standards, making it suitable for data-intensive applications.
3. DSP Capabilities: Includes DSP slices for efficient signal processing tasks.
4. Memory Blocks: Offers embedded memory resources for data storage and retrieval.
5. Power Management: Features advanced power management capabilities, enhancing efficiency.
6. Clock Management: Provides clock management tiles for flexible and reliable clock distribution.
This device is suitable for applications in telecommunications, data centers, and aerospace where high performance and flexibility are required.

Manufacturer

The XCVM1502-1MSEVFVC1760 is a product manufactured by Xilinx, which is a part of AMD (Advanced Micro Devices) following its acquisition. Xilinx is renowned for its development of programmable logic devices, including FPGAs (Field Programmable Gate Arrays), SoCs (System on Chips), and ACAPs (Adaptive Compute Acceleration Platforms). These products are used in a variety of applications including telecommunications, data centers, automotive, and industrial sectors. Xilinx's technologies are integral to creating adaptive and intelligent computing solutions, which allow for high performance and flexibility in various computing tasks.

Application

The XCVM1502-1MSEVFVC1760 is typically used in advanced computing applications requiring high-performance processing and energy efficiency. Common application areas include AI and machine learning systems, data centers, and cloud computing infrastructures. It is also utilized in telecommunications for network optimization, and in automotive industries for supporting autonomous vehicle technologies. Its capabilities make it suitable for handling large datasets and performing complex computations efficiently.

Equivalent

The XCVM1502-1MSEVFVC1760 is a Xilinx Versal ACAP chip. Equivalent products might include other chips from the Xilinx Versal series with similar specifications or offerings from competing brands like Intel's Agilex series. Exact equivalents would depend on the specific requirements such as processing power, DSP capabilities, and I/O interfaces. It's important to compare the datasheets for precise feature and performance matches.

Envío

Métodos de envíoNosotros

ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.


Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

El plazo de pago es 100% prepagado.

Actualmente, solo aceptamos los siguientes métodos de pago:

1. de PayPal

2. Tarjeta de crédito/débito

3. Transferencia bancaria