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XCV300E-6FG456I
IC FPGA 312 I/O 456FBGA
- Fabricante
- Mfr. Parte #XCV300E-6FG456I
- Paquete 456-BBGA
- Hoja de datos
- En stock2931
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Especificaciones
| Package | Tray |
| Series | Virtex®-E |
| ProductStatus | Obsolete |
| NumberofLABs/CLBs | 1536 |
| NumberofLogicElements/Cells | 6912 |
| TotalRAMBits | 131072 |
| NumberofI/O | 312 |
| NumberofGates | 411955 |
| Voltage-Supply | 1.71V ~ 1.89V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 456-BBGA |
Descripción general
Description
The "6" in the model number indicates the speed grade, with lower numbers signifying faster performance. The "FG456" denotes the package type, which is a fine-pitch ball grid array (FBGA) with 456 pins, ensuring efficient heat dissipation and compact design. The XCV300E also supports advanced features like embedded block RAM, digital signal processing (DSP) slices, and high-speed serial transceivers, enabling designers to implement complex algorithms and signal processing tasks. Overall, this FPGA is well-suited for applications that require a balance of performance, power efficiency, and design flexibility.
Features
1. Logic Cells: Approximately 300,000 logic cells, providing substantial computational power.
2. Configurable I/O: Supports versatile I/O standards, with up to 576 I/O pins.
3. High-Speed Interfaces: Includes transceivers capable of operating at speeds up to 6.5 Gbps.
4. Memory: Integrated block RAM and distributed RAM for efficient data storage and processing.
5. Digital Signal Processing (DSP): Contains dedicated DSP slices optimized for high-performance arithmetic operations.
6. Power Management: Features advanced power management capabilities for efficiency.
7. Package: Available in a 456-ball Fine-Pitch Ball Grid Array (FBGA) package.
8. Programmability: Supports multiple design tools and environments for flexible programming options.
The XCVC300E is ideal for applications requiring high-speed processing and flexibility.
Package
Pinout
- I/O Pins: For general input/output operations, allowing interfacing with other devices.
- Power Supply Pins: Providing power to the FPGA.
- Configuration Pins: For configuring the FPGA during startup.
- Ground Pins: For grounding the device.
- Clock Pins: For clock signals that drive synchronous operations within the FPGA.
The XCV300E series is designed for high-performance applications, featuring programmable logic, digital signal processing capabilities, and various I/O standards support. It operates with a voltage supply of 1.5V, and the '-6' indicates its speed grade.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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