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XCV300E-6FG256C
IC FPGA 176 I/O 256FBGA
- Fabricante
- Mfr. Parte #XCV300E-6FG256C
- Paquete
- Hoja de datos XCV300E-6FG256C DataSheet
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Especificaciones
| Series | Virtex®-E |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Total RAM Bits | 131072 |
| Number of I/O | 176 |
| Number of Gates | 411955 |
| Voltage - Supply | 1.71V ~ 1.89V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 256-BGA |
| Supplier Device Package | 256-FBGA (17x17) |
| Base Product Number | XCV300E |
| Number of Logic Elements/Cells | 6912 |
| Number of LABs/CLBs | 1536 |
Descripción general
Description
This FPGA is known for its flexibility, allowing designers to program and reprogram the hardware to accommodate various applications. It supports a wide range of I/O standards and includes dedicated resources such as digital signal processing (DSP) slices, block RAM, and multipliers, making it suitable for tasks like signal processing, telecommunications, and embedded systems.
The XCV300E-6FG256C is often chosen for its balance of performance, power efficiency, and reconfigurability, making it ideal for prototyping and production in diverse industries.
Features
1. Logic Cells: 300,000 logic cells, providing substantial processing power.
2. DSP Slices: Integrated DSP (Digital Signal Processing) slices for high-speed arithmetic operations.
3. Block RAM: Up to 16 Mb of block RAM for efficient data storage and retrieval.
4. I/O Pins: 256 I/O pins with support for various signaling standards, enabling flexible interfacing.
5. High-Speed Serial Transceivers: Up to 12 high-speed transceivers for fast data communication.
6. Low Power Consumption: Designed for energy efficiency, making it suitable for power-sensitive applications.
7. Flexible Architecture: Supports various design paradigms, including complex algorithms and diverse applications.
8. Enhanced Security Features: Built-in security options to protect IP and designs against unauthorized access.
This FPGA is ideal for applications in telecommunications, automotive, industrial control, and more, offering a balance of performance and efficiency.
Package
Pinout
Key functions of the XCV300E series include support for various digital logic designs, programmable interconnects, and I/O capabilities. It offers multiple I/O standards, including LVTTL, LVCMOS, and others, allowing for integration with different logic levels. Additionally, the device supports advanced features such as embedded block RAM, DSP slices, and configurable logic blocks to facilitate complex designs in communications, automotive, and industrial applications.
Overall, the XCV300E-6FG256C is notable for its versatility and capability to be reconfigured for various tasks post-manufacture.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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