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XCKU5P-2FFVB676E
IC FPGA 280 I/O 676FCBGA
- Fabricante
- Mfr. Parte #XCKU5P-2FFVB676E
- Paquete
- Hoja de datos
- En stock3739
100% original & Nuevo
24 horas listos para el envío
Garantía de 365 días
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Especificaciones
| Series | Kintex® UltraScale+™ |
| Part Status | Active |
| DigiKey Programmable | Not Verified |
| Total RAM Bits | 41984000 |
| Number of I/O | 280 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| Base Product Number | XCKU5 |
| Number of Logic Elements/Cells | 474600 |
| Number of LABs/CLBs | 27120 |
Descripción general
Description
Key specifications include:
- Logic Cells: Approximately 1.3 million.
- DSP Slices: Around 420, designed for efficient digital signal processing.
- Transceivers: Support for high-speed interfaces, including 28 Gbps connectivity.
- Memory: Integrated support for various types of memory, including DDR4 and QDR.
The device is optimized for power efficiency and offers advanced features such as partial reconfiguration and high bandwidth memory (HBM) support. It is widely used for applications involving machine learning, video processing, and network processing, among others. The XCKU5P-2FFVB676E is encapsulated in a compact BGA package, facilitating integration into complex systems while ensuring robust performance and flexibility.
Features
1. Logic Cells: Approximately 110,000 logic cells for complex designs.
2. DSP Slices: 360 DSP slices optimized for digital signal processing tasks.
3. Memory: Supports up to 6.5 Mb of Block RAM and UltraRAM for high-speed data storage.
4. I/O Support: Features up to 200 I/O pins with support for various protocols, including LVDS and PCIe.
5. Transceivers: Equipped with 12.5 Gbps transceivers for high-speed data communication.
6. Power Efficiency: Designed for low power consumption, making it suitable for battery-operated devices.
7. Flexibility: Supports multiple application domains including telecommunications, automotive, and industrial automation.
8. Design Tools: Compatible with Xilinx Vivado Design Suite for efficient development and implementation.
This FPGA is ideal for applications requiring high bandwidth and processing capabilities while maintaining a compact form factor.
Package
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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