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XCKU3P-2FFVA676I
IC FPGA 256 I/O 676FCBGA
- Fabricante
- Mfr. Parte #XCKU3P-2FFVA676I
- Paquete
- Hoja de datos
- En stock3150
100% original & Nuevo
24 horas listos para el envío
Garantía de 365 días
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Especificaciones
| Series | Kintex® UltraScale+™ |
| Part Status | Active |
| Base Product Number | XCKU3 |
| DigiKey Programmable | Not Verified |
| Number of LABs/CLBs | 20340 |
| Number of Logic Elements/Cells | 355950 |
| Total RAM Bits | 31641600 |
| Number of I/O | 256 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| Packaging | Tray |
Descripción general
Description
Key features include:
1. Architecture: Utilizes a 16nm FinFET process technology, providing improved performance and power efficiency.
2. Logic Cells: Contains over 300,000 logic cells, enabling complex designs and computations.
3. Memory: Supports large amounts of embedded memory, including block RAM and UltraRAM, for efficient data handling.
4. I/O and Connectivity: Offers numerous high-speed transceivers and versatile I/O options for integrating with various peripherals and communication protocols.
5. Development Environment: Compatible with Xilinx’s Vivado Design Suite, which facilitates design, simulation, and implementation processes.
Overall, the XCKU3P-2FFVA676I is suitable for applications that demand high throughput and low latency, making it a popular choice among developers and engineers in advanced computing fields.
Features
1. Logic Cells: It contains approximately 215,360 logic cells, providing ample resources for complex algorithms and data processing.
2. DSP Slices: Equipped with 840 DSP slices, suitable for high-speed signal processing tasks.
3. Block RAM: Features 18.4 Mb of block RAM, which supports data storage and buffering functions.
4. I/O Capabilities: Up to 384 user I/O pins, supporting various voltage standards for flexibility in interfacing with other components.
5. Transceivers: Includes 16 multi-gigabit transceivers (MGTs) supporting data rates up to 28.5 Gbps, ideal for high-speed data communication.
6. Power: Offers low power consumption, making it suitable for power-sensitive applications.
7. Development Tools: Compatible with Xilinx Vivado Design Suite, enabling efficient design and debugging workflows.
This FPGA is well-suited for applications in telecommunications, data center, and embedded systems.
Package
Pinout
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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