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XCKU3P-1FFVB676I
IC FPGA 280 I/O 676FCBGA
- Fabricante
- Mfr. Parte #XCKU3P-1FFVB676I
- Paquete FBGA-676
- Hoja de datos
- En stock3862
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Especificaciones
| Package | Tray |
| Series | Kintex® UltraScale+™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 20340 |
| NumberofLogicElements/Cells | 355950 |
| TotalRAMBits | 31641600 |
| NumberofI/O | 280 |
| Voltage-Supply | 0.825V ~ 0.876V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 676-BBGA, FCBGA |
Descripción general
Description
With a low power consumption profile, the XCKU3P-1FFVB676I supports advanced features like partial reconfiguration and dynamic voltage scaling, enhancing its efficiency and adaptability. It operates at a maximum clock frequency of 600 MHz and provides substantial logic resources, including thousands of logic cells and configurable I/O blocks. The Kintex UltraScale+ architecture leverages 16nm FinFET technology, resulting in improved performance-per-watt compared to previous generations. This makes the XCKU3P-1FFVB676I an ideal choice for developers seeking to implement complex algorithms and data processing tasks in a customizable hardware platform.
Features
1. Logic Cells: Approximately 102,000 logic cells for high-performance computing.
2. DSP Slices: 300+ DSP slices for efficient digital signal processing capabilities.
3. Memory: Supports over 5.5 Mbits of block RAM and 512 Kbits of distributed RAM.
4. I/O Capabilities: Features up to 60 LVDS I/O pairs and supports various I/O standards, including LVDS, LVCMOS, and more.
5. Clock Management: Integrated clock management features, including MMCMs (Mixed-Mode Clock Managers) and PLLs (Phase-Locked Loops).
6. Power Consumption: Designed for lower power usage while providing high performance.
7. Package Type: Comes in a 676-ball FBG676 package, suitable for various applications.
8. Applications: Ideal for high-speed serial connectivity, video processing, and data acquisition tasks.
These features make it suitable for demanding applications in telecommunications, aerospace, and industrial automation.
Package
Pinout
The primary functions of this FPGA include high-performance digital signal processing, data processing, and various high-speed communication applications. The device integrates a range of programmable logic resources, including configurable logic blocks (CLBs), digital signal processing (DSP) slices, block RAM (BRAM), and high-speed transceivers. It is designed for applications in areas such as telecommunications, automotive, and data center processing, providing flexibility and scalability for complex designs.
Additionally, it supports multiple I/O standards, enabling connectivity with various external devices and systems.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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