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XCKU15P-2FFVA1156I
IC FPGA 516 I/O 1156FCBGA
- Fabricante
- Mfr. Parte #XCKU15P-2FFVA1156I
- Paquete FCBGA-1156
- Hoja de datos
- En stock5636
100% original & Nuevo
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Garantía de 365 días
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Especificaciones
| Package | Tray |
| Series | Kintex® UltraScale+™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 65340 |
| NumberofLogicElements/Cells | 1143450 |
| TotalRAMBits | 82329600 |
| NumberofI/O | 516 |
| Voltage-Supply | 0.825V ~ 0.876V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 1156-BBGA, FCBGA |
Descripción general
Description
Key specifications include a dual-mode (SRAM/Flash) configuration, support for high-speed serial transceivers, and an extensive array of I/O options. The device operates at high clock frequencies, enabling it to handle complex algorithms and real-time processing tasks efficiently.
The FFVA1156 package indicates a fine-pitch ball grid array (FBGA) with 1156 pins, allowing for dense integration and reduced board space. The "I" suffix denotes an industrial-grade variant, ensuring reliable operation across a wide temperature range.
Overall, the XCKU15P-2FFVA1156I is designed for scalability and flexibility, making it an ideal choice for developers looking to implement advanced digital designs in various demanding environments.
Features
1. Logic Cells: Approximately 15,000 logic cells for complex designs.
2. DSP Slices: Up to 60 DSP slices, suitable for high-speed digital signal processing tasks.
3. Memory: Supports embedded memory blocks, including up to 1.4 Mb of block RAM.
4. I/O Capabilities: Offers a wide range of I/O standards and up to 420 user I/O pins.
5. High-Speed Transceivers: Equipped with high-speed transceivers capable of 6.6 Gbps to support various communication protocols.
6. Power Efficiency: Designed for optimal power consumption, making it ideal for embedded and data center applications.
7. Configuration Options: Supports multiple configuration methods including JTAG and SPI.
This FPGA is suitable for applications in telecommunications, automotive, industrial automation, and video processing.
Package
Pinout
Functions of the pins include general-purpose I/O (GPIO), dedicated configuration, power supply, ground connections, and high-speed transceivers for data communication. The FPGA can be used in diverse applications such as communications, automotive, industrial, and data center solutions, providing flexibility for custom designs. The FPGA is housed in a flip-chip package, allowing for improved thermal performance and higher pin density.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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