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XCKU13P-2FFVE900I
IC FPGA 304 I/O 900FCBGA
- Fabricante
- Mfr. Parte #XCKU13P-2FFVE900I
- Paquete FBGA-900
- Hoja de datos
- En stock4532
100% original & Nuevo
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Garantía de 365 días
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Especificaciones
| Package | Tray |
| Series | Kintex® UltraScale+™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 42660 |
| NumberofLogicElements/Cells | 746550 |
| TotalRAMBits | 70656000 |
| NumberofI/O | 304 |
| Voltage-Supply | 0.825V ~ 0.876V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 900-BBGA, FCBGA |
Descripción general
Description
This FPGA is ideal for applications requiring high throughput and low latency, such as telecommunications, data centers, automotive systems, and machine learning. It supports high-speed transceivers capable of achieving data rates up to 28 Gbps, facilitating efficient data transfer. The device is housed in a compact FFG900 package, making it suitable for space-constrained designs.
XCKU13P-2FFVE900I is programmable via the Vivado Design Suite, enabling efficient design, simulation, and synthesis workflows. Its reliability and scalability make it a preferred choice for engineers aiming to create innovative solutions in diverse industries.
Features
- Architecture: Supports the UltraScale architecture for improved performance and efficiency.
- Logic Cells: Approximately 13,000 logic cells for complex logic implementation.
- DSP Slices: Up to 1,440 DSP slices for high-speed arithmetic operations, ideal for digital signal processing applications.
- Memory: Up to 1.5 MB of block RAM and support for ultra-high-speed serial transceivers.
- I/O Capabilities: Flexible I/O options, including high-speed transceivers (up to 28 Gbps).
- Power Efficiency: Optimized for lower power consumption while delivering high performance.
- Configuration: Supports various configuration modes and interfaces, including JTAG and SPI.
- Applications: Suitable for data centers, wireless communications, video processing, and embedded systems.
Overall, the XCKU13P-2FFVE900I balances high performance with versatility, making it ideal for demanding applications in various industries.
Package
Pinout
- Configurable I/O: Supports various I/O standards.
- High-speed transceivers: Up to 32 Gbps data rates for high-performance applications.
- Digital signal processing (DSP) slices: Designed for complex computations.
- Memory interfaces: Supports external memory connectivity.
- Power management: Offers features for efficient power consumption.
This FPGA is suitable for a wide range of applications, including telecommunications, data centers, and industrial automation, thanks to its flexibility and performance.
Manufacturer
Application
Equivalent
1. XCKU13P-2FFVE900C
2. XCKU13P-2FFVB900I
3. XCKU13P-2FFVB900C
These alternatives offer similar functionalities but may vary in features like temperature range and packaging. Always check specific requirements for compatibility.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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