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XCKU11P-2FFVD900E
IC FPGA 408 I/O 900FCBGA
- Fabricante
- Mfr. Parte #XCKU11P-2FFVD900E
- Paquete FBGA-900
- Hoja de datos
- En stock3309
100% original & Nuevo
24 horas listos para el envío
Garantía de 365 días
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Especificaciones
| Package | Tray |
| Series | Kintex® UltraScale+™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 37320 |
| NumberofLogicElements/Cells | 653100 |
| TotalRAMBits | 53964800 |
| NumberofI/O | 408 |
| Voltage-Supply | 0.825V ~ 0.876V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 100°C (TJ) |
| Package/Case | 900-BBGA, FCBGA |
Descripción general
Description
Key specifications include 11,500 logic cells, 36 DSP slices for efficient signal processing, and up to 900K configurable logic gates. Its 2D architecture enables enhanced performance for complex algorithms used in applications like machine learning, video processing, and telecommunications.
The device operates at high speeds and supports various protocols, making it suitable for industries such as aerospace, automotive, and networking. Additionally, it comes with programmable logic, allowing users to tailor the hardware to specific needs. The XCKU11P-2FFVD900E is ideal for engineers seeking flexibility and efficiency in custom hardware designs.
Features
1. Architecture: 11K logic cells with advanced 28nm process technology, offering a balance of performance and power efficiency.
2. DSP Slices: Equipped with 120 DSP slices, enabling efficient digital signal processing.
3. Memory: Includes up to 7.2 Mb of Block RAM and support for various types of memory interfaces.
4. I/O: Supports up to 540 user I/O pins, with capabilities for high-speed transceivers (up to 12.5 Gbps).
5. Flexibility: Ideal for applications in telecommunications, automotive, aerospace, and industrial control systems.
6. Power: Lower power consumption compared to previous generations, making it suitable for portable and energy-sensitive applications.
7. Tools: Compatible with Xilinx Vivado Design Suite for efficient design and debugging.
Overall, the XCKU11P-2FFVD900E combines high logic density, extensive I/O capabilities, and advanced processing features, catering to demanding applications in various industries.
Package
Pinout
The functions of these pins include various I/O capabilities, power supply connections, and configuration interfaces. The device supports high-speed serial transceivers, general-purpose I/Os, and dedicated clock management inputs. The pins are organized to facilitate various functions such as logic I/O, configuration, and power management.
Overall, the diverse functionality of the pins enables the implementation of complex digital designs for applications in areas like telecommunications, automotive, and data processing.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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