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XCKU11P-1FFVD900E
IC FPGA 408 I/O 900FCBGA
- Fabricante
- Mfr. Parte #XCKU11P-1FFVD900E
- Paquete
- Hoja de datos
- En stock7087
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Especificaciones
| Series | Kintex® UltraScale+™ |
| Part Status | Active |
| DigiKey Programmable | Not Verified |
| Total RAM Bits | 53964800 |
| Number of I/O | 408 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
| Base Product Number | XCKU11 |
| Number of Logic Elements/Cells | 653100 |
| Number of LABs/CLBs | 37320 |
Descripción general
Description
The "1FF" part of the designation indicates the device's process technology (28nm) and packaging type (FCLGA), while "VD900" refers to its power supply voltage and available I/O voltage levels. The device offers flexible I/O configurations and is optimized for low power consumption, making it ideal for both embedded and standalone applications.
With support for Xilinx's Vivado design suite, the XCKU11P allows designers to develop sophisticated designs efficiently. Its combination of performance, versatility, and power efficiency makes it a popular choice in industries such as telecommunications, automotive, and aerospace.
Features
1. Logic Cells: Approximately 110,000 logic cells for complex computations.
2. DSP Slices: 220 DSP slices for high-speed digital signal processing.
3. Memory: 7.5 Mbits of block RAM for efficient data storage.
4. I/O Capabilities: Supports multiple high-speed I/O standards, including LVDS, with up to 200 I/Os.
5. Transceivers: Equipped with 16 transceivers supporting speeds up to 12.5 Gbps for high-bandwidth applications.
6. Power Efficiency: Designed for lower power consumption while maintaining performance.
7. Configuration: Supports various configuration modes, including JTAG and SPI.
8. Applications: Ideal for data centers, 5G infrastructure, and high-performance computing.
Overall, the XCKU11P is suitable for demanding applications requiring flexibility and speed in processing.
Package
Pinout
This FPGA is designed for high-performance applications, offering a range of functionalities including programmable logic, high-speed serial transceivers, and various I/O capabilities. It supports multiple configurations for applications in telecommunications, data centers, and industrial automation.
Key functions include digital signal processing, parallel processing, and interfacing with other components using its versatile I/O standards. The device is well-suited for tasks requiring high bandwidth and low latency, enabling it to handle complex computations and data processing tasks effectively.
Manufacturer
Application
Equivalent
1. Intel Agilex FPGA (e.g., AGF020)
2. Lattice Semiconductor CrossLink-NX
3. Microsemi SmartFusion2
For close performance and features, consider other Xilinx Kintex UltraScale variants, such as the XCKU10 or XCKU15 models, depending on specific requirements like logic capacity and I/O configuration. Always check specific datasheets for compatibility.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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