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XCKU115-2FLVF1924I
IC FPGA 728 I/O 1924FCBGA
- Fabricante
- Mfr. Parte #XCKU115-2FLVF1924I
- Paquete FBGA-1924
- Hoja de datos
- En stock5048
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Especificaciones
| Package | Tray |
| Series | Kintex® UltraScale™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 82920 |
| NumberofLogicElements/Cells | 1451100 |
| TotalRAMBits | 77721600 |
| NumberofI/O | 728 |
| Voltage-Supply | 0.922V ~ 0.979V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 1924-BBGA, FCBGA |
Descripción general
Description
The device supports various protocols and interfaces, including PCIe, Ethernet, and HDMI, making it suitable for diverse industries such as telecommunications, automotive, and aerospace. It also integrates advanced features like DSP slices for digital signal processing, block RAM for high-speed memory operations, and flexible clock management resources.
The XCKU115-2FLVF1924I is housed in a FFG1924 package, offering a robust solution for applications that require high throughput and low latency. With its scalability and adaptability, this FPGA can be programmed to meet specific design requirements, making it a valuable component in modern digital systems.
Features
1. Logic Cells: Approximately 115,000 logic cells, providing significant processing capability.
2. DSP Slices: Around 360 DSP slices for high-speed digital signal processing.
3. Memory: Up to 6.6 Mbit of ultra RAM and 2.5 Mbit of distributed RAM for efficient data storage and access.
4. I/O: Supports a wide range of I/O standards, including high-speed transceivers (up to 28 Gbps).
5. Configuration: Dual configuration options (flash and JTAG) for flexibility.
6. Power Efficiency: Optimized for low power consumption while maintaining performance.
7. Dense Interconnect: Features high-density interconnect for more compact designs.
This FPGA is ideal for applications in data centers, telecom, and high-performance computing, offering a balance of performance, flexibility, and efficiency.
Package
Pinout
The device features a variety of functions, including high-speed serial interfaces, digital signal processing capabilities, and ample I/O options. It supports multiple configurations through its programmable logic, enabling application in diverse fields like telecommunications, automotive, and industrial applications. The architecture allows for efficient handling of complex computations and data processing tasks, making it suitable for high-performance applications.
For detailed specifications, including I/O standards and power requirements, refer to the official Xilinx documentation.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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