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XCKU115-2FLVB1760I
IC FPGA 702 I/O 1760FCBGA
- Fabricante
- Mfr. Parte #XCKU115-2FLVB1760I
- Paquete FBGA-1760
- Hoja de datos
- En stock7294
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Especificaciones
| Package | Bulk |
| Series | Kintex® UltraScale™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 82920 |
| NumberofLogicElements/Cells | 1451100 |
| TotalRAMBits | 77721600 |
| NumberofI/O | 702 |
| Voltage-Supply | 0.922V ~ 0.979V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 1760-BBGA, FCBGA |
Descripción general
Description
The “2” in the designation indicates the speed grade, while “FLVB1760” refers to the package type and pin count. The FPGA supports various I/O standards and connectivity options, allowing integration with diverse systems. It is also compatible with Xilinx's development tools, including Vivado, facilitating design and implementation.
This FPGA is ideal for applications requiring high bandwidth and low latency, such as telecommunications, aerospace, automotive, and industrial automation. Its flexibility allows for reconfiguration post-deployment, making it a preferred choice for evolving technology needs.
Features
1. Architecture: Utilizes a 16nm FinFET technology, providing enhanced performance and lower power consumption.
2. Logic Resources: Offers 115K logic cells, 3360 Kbits of block RAM, and up to 576 DSP slices for efficient data processing.
3. I/O Interfaces: Supports various I/O standards, including LVDS, LVCMOS, and others, with up to 720 user I/Os.
4. Performance: Delivers high clock speeds, facilitating complex computations and high-throughput applications.
5. Connectivity: Includes multiple high-speed transceivers (up to 28 Gbps), supporting various protocols like PCIe, Ethernet, and Serial RapidIO.
6. Power Management: Features advanced power management capabilities, enabling dynamic power scaling and optimization.
7. Applications: Ideal for data centers, telecommunications, automotive, and embedded systems requiring high bandwidth and performance.
This combination of features makes the XCKU115-2FLVB1760I suitable for a wide range of demanding applications.
Package
Pinout
The pin functions of this device include various I/O, power, ground, and configuration pins. The I/O pins can be configured for different standards, allowing for high-speed communication and integration with other components. The FPGA supports multiple protocols such as PCIe, Ethernet, and more, making it suitable for a wide range of applications, including data centers, telecommunications, and industrial systems.
Additionally, the device features dedicated pins for clock management, configuration (JTAG), and power supply connections. It is designed for flexibility and performance, suitable for high-performance computing tasks.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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