XC7Z045-3FFG900E

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XC7Z045-3FFG900E

IC SOC CORTEX-A9 1GHZ 900FCBGA

  • Fabricante
  • Mfr. Parte #XC7Z045-3FFG900E
  • Paquete FBGA-900
  • Hoja de datos
  • En stock5271

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Especificaciones

Package Tray
Series Zynq®-7000
ProductStatus Active
Architecture MCU, FPGA
CoreProcessor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAMSize 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1GHz
PrimaryAttributes Kintex™-7 FPGA, 350K Logic Cells
OperatingTemperature 0°C ~ 100°C (TJ)
Package/Case 900-BBGA, FCBGA

Descripción general

Description

The XC7Z045-3FFG900E is part of Xilinx's Zynq-7000 family, which integrates a dual-core ARM Cortex-A9 processor with Xilinx 7-Series FPGA logic. This SoC (System on Chip) is designed for high-performance applications, combining the flexibility of programmable logic with the processing power of a multicore CPU.
Key features include:
- Dual-core ARM Cortex-A9: Operates up to 1 GHz, ideal for running complex algorithms and real-time applications.
- FPGA Fabric: Contains 45,000 logic cells, enabling custom hardware acceleration tailored to specific tasks.
- Connectivity Options: Supports various interfaces, including USB, Ethernet, and PCIe, facilitating communication with external devices.
- Memory Interfaces: Compatible with DDR3 and other memory technologies for enhanced data throughput.
- Power Management: Designed for efficient power consumption, making it suitable for embedded systems and mobile applications.
This device is widely used in industries such as automotive, telecommunications, and medical for applications requiring both high processing and flexible hardware capabilities.

Features

The XC7Z045-3FFG900E is a member of the Xilinx Zynq-7000 series, which combines a dual-core ARM Cortex-A9 processor and FPGA fabric on a single chip. Key features include:
- Processing Power: Dual-core ARM Cortex-A9, up to 1 GHz.
- FPGA Logic: 85K logic cells, providing ample programmable resources for custom logic.
- Memory: Supports up to 1 MB of on-chip memory and external memory interfaces, including DDR3, DDR2, and LPDDR2.
- I/O Interfaces: Extensive connectivity options, including USB, Ethernet, SPI, I2C, and UART.
- High-Speed Transceivers: Up to 12.5 Gbps transceiver capability for high-speed data communication.
- Power Consumption: Optimized for low power, making it suitable for embedded applications.
- Development Tools: Compatible with Xilinx's Vivado Design Suite for design and simulation.
This device is ideal for applications in automotive, industrial, and telecommunications, where processing and customized hardware acceleration are critical.

Package

The XC7Z045-3FFG900E is packaged in a FFG (Fine Pitch Ball Grid Array) package type. It features a 900-ball configuration and is designed for high-density applications, providing efficient thermal management and improved electrical performance.

Pinout

The XC7Z045-3FFG900E is a Field Programmable Gate Array (FPGA) from Xilinx's Zynq-7000 series. It features a pin count of 900, housed in a Fine Pitch Ball Grid Array (FBGA) package.
The device combines a dual-core ARM Cortex-A9 processor with programmable logic, enabling a range of applications from embedded systems to high-performance computing. The pins serve multiple functions, including power supply pins (VCC and GND), I/O pins for communication protocols (like I2C, SPI, UART), and dedicated pins for configuration, clock inputs, and high-speed transceivers.
This integration of a processor with programmable logic allows for significant flexibility in designing complex systems on a chip, catering to various applications in automotive, industrial, and consumer electronics.

Manufacturer

The manufacturer of the XC7Z045-3FFG900E is Xilinx, Inc. Xilinx is a semiconductor company known for its development of programmable logic devices, particularly field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and system-on-a-chip (SoC) solutions. Founded in 1984, Xilinx pioneered the FPGA technology, which allows users to configure hardware for specific applications after manufacturing. The XC7Z045-3FFG900E is part of Xilinx's Zynq-7000 series, which integrates a dual-core ARM Cortex-A9 processor with FPGA logic, enabling a wide range of applications in communications, automotive, industrial, and aerospace sectors. In 2020, Xilinx was acquired by AMD, further enhancing its capabilities in the semiconductor industry.

Application

The XC7Z045-3FFG900E, part of the Xilinx Zynq-7000 series, is commonly used in embedded systems for applications such as industrial automation, automotive systems, medical devices, and telecommunications. Its combination of a dual-core ARM Cortex-A9 processor with programmable logic enables it to handle complex processing tasks, real-time control, and high-speed data processing, making it suitable for IoT, video processing, and machine learning applications.

Equivalent

The XC7Z045-3FFG900E chip, part of the Xilinx Zynq-7000 series, can be equivalently replaced by the XC7Z045-2FFG900E for slightly lower performance requirements or the XC7Z045-3FFG676C for a different package type. However, for specific applications, consulting datasheets and performance characteristics is essential, as exact equivalence may depend on power, temperature ranges, and I/O requirements.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

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