XC7Z035-L2FFG676I

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XC7Z035-L2FFG676I

IC SOC CORTEX-A9 800MHZ 676FCBGA

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  • Mfr. Parte #XC7Z035-L2FFG676I
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Especificaciones

Series Zynq®-7000
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Base Product Number XC7Z035

Descripción general

Description

The XC7Z035-L2FFG676I is a device from Xilinx's Zynq-7000 series, specifically designed for embedded systems. It integrates a dual-core ARM Cortex-A9 processor with Xilinx's 7-series FPGA fabric, allowing for a versatile combination of software and hardware processing.
Key specifications include:
- Logic Cells: Approximately 35,000 LUTs, enabling significant logic capacity for custom applications.
- Memory: Features 1 MB of block RAM and support for various interfaces, facilitating the handling of data-intensive operations.
- I/O: Offers up to 85 programmable I/O pins, supporting multiple communication protocols and peripherals.
- Power: Operates at a nominal voltage of 1.0V, with a typical power consumption tailored for embedded applications.
This device is ideal for applications requiring high-performance computing, such as automotive, industrial automation, and consumer electronics. The combination of ARM processing and FPGA flexibility makes it suitable for real-time processing tasks and complex algorithm implementations.

Features

The XC7Z035-L2FFG676I is a member of the Xilinx Zynq-7000 family, integrating a dual-core ARM Cortex-A9 processor and Xilinx 7-series FPGA logic. Key features include:
1. Processor: Dual-core ARM Cortex-A9 at up to 1 GHz.
2. FPGA Logic: 35,000 logic cells, allowing for extensive custom logic design.
3. Memory: Supports up to 1 GB of DDR3/DDR3L memory with a 32-bit wide interface.
4. I/O Ports: 108 programmable I/O pins with flexible configuration options.
5. High-Speed Interfaces: Supports multiple high-speed interfaces including Gigabit Ethernet, USB 2.0, and UART.
6. DSP Slices: Includes DSP slices for high-performance signal processing.
7. Power: Operates with typical power consumption of 1-2 W, suitable for various applications.
8. Package: Available in a 676-pin FFG package.
This device is ideal for applications in automotive, industrial, and telecommunications sectors, enabling both processing and programmable logic in a single chip.

Package

The XC7Z035-L2FFG676I is packaged in a FFG676 (Fine Pitch Ball Grid Array) format. This package type features 676 balls arranged in a 23mm x 23mm footprint, providing a compact layout for efficient thermal and electrical performance in various applications.

Pinout

The XC7Z035-L2FFG676I is a member of the Xilinx Zynq-7000 series SoC (System on Chip) devices. It features a pin count of 676 pins housed in a Fine-pitch Ball Grid Array (FBGA) package.
The device integrates both programmable logic and a processing system, combining a dual-core ARM Cortex-A9 processor with FPGA fabric. Key functions include digital signal processing, embedded system design, and real-time control applications. The SoC supports various I/O standards, including LVDS, LVCMOS, and others, enabling connectivity and interfacing with multiple peripherals. Additionally, it provides GPIO, SPI, I2C, UART, and Ethernet interfaces for versatile application development.
The XC7Z035 also includes memory interfaces like DDR3 and other features, making it suitable for a wide range of embedded applications across industries.

Manufacturer

The XC7Z035-L2FFG676I is manufactured by Xilinx, Inc., which is a leading American technology company known for its contributions to the field of field-programmable gate arrays (FPGAs), programmable systems on chips (SoCs), and adaptive computing solutions. Founded in 1984, Xilinx focuses on providing innovative hardware and software solutions that enable engineers to develop customizable and sophisticated electronic systems. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further enhancing its capabilities in the semiconductor industry. The company serves a diverse range of markets, including telecommunications, automotive, aerospace, and industrial applications, leveraging its expertise in reconfigurable computing technology.

Application

The XC7Z035-L2FFG676I is a Zynq-7000 series SoC that combines a dual-core ARM Cortex-A9 processor with FPGA logic. Its application areas include embedded systems, industrial automation, automotive systems, medical devices, telecommunications, and digital signal processing. It is widely used in applications requiring high performance, real-time processing, and flexible hardware configurations.

Equivalent

The XC7Z035-L2FFG676I is a part of the Xilinx Zynq-7000 series. Equivalent products include the XC7Z020, XC7Z030, and XC7Z045, varying mainly in logic cell count, memory, and performance. Other alternatives can be selected based on specific application needs within the Zynq-7000 series or similar devices in the Xilinx portfolio, or from competitors like Intel (Altera) and Microsemi (now part of Microchip), depending on the required specifications. Always check compatibility with your design requirements.

Envío

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DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

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