XC7Z035-1FBG676I

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XC7Z035-1FBG676I

IC SOC CORTEX-A9 667MHZ 676FCBGA

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  • Mfr. Parte #XC7Z035-1FBG676I
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Especificaciones

Series Zynq®-7000
Part Status Active
Base Product Number XC7Z035
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Packaging Tray

Descripción general

Description

The XC7Z035-1FBG676I is a member of the Xilinx Zynq-7000 family, which combines a dual-core ARM Cortex-A9 processor with Xilinx’s 7-series FPGA fabric. This SoC (System on Chip) is designed for a variety of applications, including automotive, industrial, and communication systems.
Key features include:
- Processing System (PS): Dual ARM Cortex-A9 cores running up to 1 GHz, with support for NEON SIMD and hardware virtualization.
- Programmable Logic (PL): Configurable FPGA resources, allowing for custom hardware acceleration and parallel processing.
- Memory Interfaces: Supports DDR3 and DDR2 memory, enabling high-bandwidth data access.
- I/O interfaces: Offers numerous I/O options, including high-speed transceivers, GPIO, UART, SPI, and I2C.
The device is housed in a 676-ball FBG package and is suitable for a range of applications that require both software programmability and hardware flexibility, enabling efficient designs in embedded systems.

Features

The XC7Z035-1FBG676I is a member of the Xilinx Zynq-7000 series, combining a dual-core ARM Cortex-A9 processor with FPGA fabric. Key features include:
1. Processor: Dual-core ARM Cortex-A9, up to 1 GHz, capable of running Linux and other operating systems.
2. FPGA Fabric: 35,000 logic cells, providing extensive programmable logic resources for custom hardware implementations.
3. Memory: Supports various memory interfaces including DDR3/DDR2 SDRAM, with up to 1 GB of RAM.
4. I/O: 84 configurable I/O pins, supporting various protocols like I2C, SPI, UART, and GPIO.
5. High-Speed Interfaces: Includes up to 4 PCIe endpoints and 4 Gigabit Ethernet transceivers.
6. Power: Operates at a typical core voltage of 0.95V, with a range of power management features.
7. Package: Available in a 676-ball FBG676 package, supporting a range of industrial applications.
This integration of processing and programmable logic allows for flexible designs in applications such as automotive, industrial control, and telecommunications.

Package

The XC7Z035-1FBG676I is packaged in a Fine Pitch Ball Grid Array (FBGA) format with 676 balls. This package type enables high-density interconnections and is suitable for applications requiring compact designs.

Pinout

The XC7Z035-1FBG676I is a member of the Xilinx Zynq-7000 series, specifically featuring a pin count of 676. This device integrates a dual-core ARM Cortex-A9 processor with Xilinx 7-series FPGA logic, providing a powerful combination of processing and programmable logic capabilities. The device is designed for high-performance applications in embedded systems, and it includes various I/O interfaces, including GPIO, UART, SPI, I2C, and more, allowing for flexible connectivity options. Additionally, it supports multiple power supply voltage levels and offers various configuration options for both the ARM and FPGA sections. The XC7Z035 is suitable for applications ranging from industrial automation to automotive systems and communications.

Manufacturer

The manufacturer of the XC7Z035-1FBG676I is Xilinx, Inc. Xilinx is a leading company in the semiconductor industry, specializing in the design and development of field-programmable gate arrays (FPGAs), programmable system-on-chips (SoCs), and adaptive compute acceleration platforms. Founded in 1984 and headquartered in San Jose, California, Xilinx is known for its innovation in reconfigurable computing technology, catering primarily to markets such as telecommunications, automotive, aerospace, defense, industrial, and consumer electronics. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its capabilities and market reach in high-performance computing and adaptive solutions.

Application

The XC7Z035-1FBG676I is a versatile System on Chip (SoC) from Xilinx's Zynq-7000 series. It is commonly used in embedded systems, industrial automation, robotics, automotive applications, medical devices, and wireless communication. Its combination of programmable logic and ARM Cortex-A9 processing power enables real-time data processing, control applications, and high-performance computing in diverse fields like IoT, machine vision, and signal processing.

Equivalent

The XC7Z035-1FBG676I is a Xilinx Zynq-7000 series SoC. Equivalent products include the XC7Z030-1FBG676I and XC7Z045-1FBG676I, which provide similar functionalities with different resource counts. Other alternatives may include SoCs from the Intel (formerly Altera) Cyclone V series, depending on the specific application requirements. Always consider factors like performance, power consumption, and available peripherals when selecting an equivalent.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

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