XC7Z030-1FBG676I

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XC7Z030-1FBG676I

IC SOC CORTEX-A9 667MHZ 676FCBGA

  • Fabricante
  • Mfr. Parte #XC7Z030-1FBG676I
  • Paquete FBGA676
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  • En stock4343

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Especificaciones

Package Tray
Series Zynq®-7000
ProductStatus Active
Architecture MCU, FPGA
CoreProcessor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAMSize 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
PrimaryAttributes Kintex™-7 FPGA, 125K Logic Cells
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 676-BBGA, FCBGA

Descripción general

Description

The XC7Z030-1FBG676I is a System on Chip (SoC) from Xilinx's Zynq-7000 series, which integrates a dual-core ARM Cortex-A9 processor with programmable logic (FPGA). This device combines the advantages of a high-performance processor with the flexibility of an FPGA, making it suitable for a wide range of applications, including industrial automation, automotive systems, and embedded vision.
Key features include 1 GB of DDR3 memory support, various I/O interfaces like USB, Ethernet, and UART, and a rich set of programmable logic resources, including 30,000 logic cells and DSP slices for signal processing tasks. The XC7Z030 operates at a maximum clock frequency of 1 GHz for the ARM cores, while the FPGA section can be configured for specific tasks, enabling parallel processing capabilities.
The package is a 676-pin FBG, facilitating various connectivity options. Overall, the XC7Z030-1FBG676I is a versatile choice for developers seeking to leverage both hardware and software processing in a single device.

Features

The XC7Z030-1FBG676I is a part of the Xilinx Zynq-7000 series, featuring a heterogeneous architecture combining a dual-core ARM Cortex-A9 processor with programmable logic (FPGA). Key features include:
- Processing System: Dual-core ARM Cortex-A9, up to 1 GHz, with support for NEON and FPU.
- FPGA Fabric: 30,000 logic cells, including 4,680 Kbits of block RAM and 140 DSP slices for high-performance signal processing.
- I/O: Up to 108 GPIOs, support for various high-speed interfaces such as USB, Ethernet, and PCIe.
- Memory: Supports DDR3 memory interfaces, with up to 1,066 Mbps data rates.
- Power Management: Operates at a range of voltages, with options for power optimization.
- Package: BGA676 with a 1.0 mm pitch, suitable for various applications requiring compact designs.
These features make the XC7Z030-1FBG676I suitable for applications in telecommunications, automotive, industrial control, and IoT systems.

Package

The XC7Z030-1FBG676I is packaged in a FBG676 format, which is a 676-pin Ball Grid Array (BGA) package. This type of package is designed for high-density applications and provides efficient thermal performance and electrical connectivity.

Pinout

The XC7Z030-1FBG676I is a part of the Xilinx Zynq-7000 series, specifically designed for applications requiring a combination of programmable logic and processing system capabilities. It has a pin count of 676 pins in a Fine Pitch Ball Grid Array (FBGA) package.
The device includes a dual-core ARM Cortex-A9 processor, programmable logic resources, and multiple interfaces for connection and communication. Functions of the pins include general-purpose I/O (GPIO), high-speed transceivers, memory interfaces, and dedicated pins for power, ground, and configuration. It supports various protocols such as I2C, SPI, UART, and more, enabling versatile connectivity options for embedded systems.
Overall, the XC7Z030-1FBG676I is well-suited for applications in automotive, industrial, and consumer electronics, providing a blend of hardware programmability and software flexibility.

Manufacturer

The XC7Z030-1FBG676I is manufactured by Xilinx, Inc., a prominent company in the semiconductor industry. Xilinx specializes in the design and production of Field Programmable Gate Arrays (FPGAs), System on Chips (SoCs), and related technologies. Their products are widely used in various applications, including telecommunications, aerospace, automotive, and industrial automation.
Xilinx was founded in 1984 and is known for pioneering the FPGA market. In 2020, it was acquired by AMD (Advanced Micro Devices), further expanding its capabilities in high-performance computing and adaptive computing technologies. The XC7Z030-1FBG676I is part of the Zynq-7000 series, which combines a processing system with an FPGA, enabling flexible and powerful solutions for embedded system design.

Application

The XC7Z030-1FBG676I, part of the Xilinx Zynq-7000 series, is used in various applications including industrial automation, automotive systems, telecommunications, medical devices, and smart grid technologies. Its combination of ARM Cortex-A9 processing and FPGA fabric enables high-performance computing for embedded systems, real-time processing, and custom hardware acceleration. Additionally, it supports video processing, image processing, and IoT devices due to its flexibility and integration capabilities.

Equivalent

The XC7Z030-1FBG676I is a Zynq-7000 SoC from Xilinx. Equivalent products include:
1. XC7Z020 - Lower performance.
2. XC7Z035 - Slightly higher performance.
3. XC7Z045 - Higher performance and more resources.
These alternatives vary in terms of logic cells, DSP slices, and memory resources. For specific applications, consider power requirements and I/O configurations.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

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