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XC7S75-2FGGA676I
IC FPGA 400 I/O 676FPBGA
- Fabricante
- Mfr. Parte #XC7S75-2FGGA676I
- Paquete
- Hoja de datos
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Especificaciones
| Series | Spartan®-7 |
| Part Status | Active |
| DigiKey Programmable | Not Verified |
| Number of Logic Elements/Cells | 76800 |
| Total RAM Bits | 4331520 |
| Number of I/O | 400 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 676-BGA |
| Supplier Device Package | 676-FPBGA (27x27) |
| Base Product Number | XC7S75 |
| Number of LABs/CLBs | 6000 |
Descripción general
Description
Key specifications include:
- Logic Cells: 75,000
- I/O Pins: Up to 50 user-configurable I/Os
- Memory: Configurable with up to 4.5 Mbits of block RAM
- DSP Slices: Approximately 30 DSP slices for digital signal processing.
- Package: Comes in a 676-ball FGGA (Fine-pitch Ball Grid Array) package, facilitating compact designs.
The Spartan-7 architecture is optimized for high performance with low power consumption, featuring advanced power management capabilities. Additionally, it supports a variety of design tools, including Vivado, which aids in simplifying the design and implementation processes. Its combination of cost-effectiveness and versatility makes the XC7S75-2FGGA676I suitable for various applications requiring programmable logic solutions.
Features
1. Logic Cells: 75,000 logic cells, providing ample processing capability for various applications.
2. I/O and Memory: Up to 108 I/O pins and support for various memory types, including DDR3, making it suitable for interfacing with external components.
3. Low Power Consumption: Optimized for low power operation, ideal for battery-powered devices and energy-sensitive applications.
4. Configurable Logic Blocks (CLBs): Each CLB consists of look-up tables (LUTs) and flip-flops, allowing for flexible logic implementation.
5. Digital Signal Processing (DSP): Integrated DSP slices for efficient processing of signal data.
6. High-Speed Transceivers: Supports transceiver interfaces for high-speed communication.
7. Development Tools: Compatibility with Xilinx Vivado Design Suite for streamlined design and development processes.
These features make the XC7S75-2FGGA676I suitable for a wide range of applications, including automotive, industrial, and consumer electronics.
Package
Pinout
Key features of the XC7S75-2FGGA676I include:
- 75K logic cells
- 4,320 configurable lookup tables (LUTs)
- 180 DSP slices for digital signal processing
- Multiple communication interfaces, including LVDS, I²C, SPI, and CAN.
The FPGA is designed for applications in communication, automotive, and industrial systems, providing flexibility and high performance for complex designs.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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