XC7K325T-3FFG900E

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XC7K325T-3FFG900E

IC FPGA 500 I/O 900FCBGA

  • Fabricante
  • Mfr. Parte #XC7K325T-3FFG900E
  • Paquete BGA900
  • Hoja de datos
  • En stock7929

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Especificaciones

Package Tray
Series Kintex®-7
ProductStatus Active
NumberofLABs/CLBs 25475
NumberofLogicElements/Cells 326080
TotalRAMBits 16404480
NumberofI/O 500
Voltage-Supply 0.97V ~ 1.03V
MountingType Surface Mount
OperatingTemperature 0°C ~ 100°C (TJ)
Package/Case 900-BBGA, FCBGA

Descripción general

Description

The XC7K325T-3FFG900E is a Field Programmable Gate Array (FPGA) from Xilinx's Kintex-7 series. It is specifically designed for high-performance, low-power applications in various industries, including telecommunications, automotive, and industrial automation.
Key features include:
- Logic Cells: Approximately 325,000 logic cells, allowing for complex digital designs.
- Configurable I/O: Up to 210 user-configurable I/O pins, supporting various protocols.
- Memory: Integrated RAM blocks and optional DSP slices for signal processing tasks.
- Performance: Operates at a maximum clock frequency of up to 450 MHz, enabling fast data processing.
- Package: Available in a 900-pin FFG (Fine Pitch Flip Chip) package, suitable for high-density applications.
The XC7K325T is ideal for applications requiring flexibility, scalability, and high throughput, making it a popular choice among engineers and developers for prototyping and deploying digital systems.

Features

The XC7K325T-3FFG900E is a field-programmable gate array (FPGA) from Xilinx's Kintex-7 series. Key features include:
- Logic Cells: 325,000 system logic cells with high-density configuration.
- DSP Slices: 840 DSP48E1 slices for high-performance digital signal processing.
- Memory: 16.3 Mb of block RAM and support for distributed RAM.
- Transceivers: Up to 12 Gbps transceiver bandwidth with 8 PCIe Gen2 lanes.
- I/O Pins: 300 user I/O pins with support for various I/O standards.
- Power Efficiency: Lower power consumption compared to previous generations, with a dynamic power range suitable for various applications.
- Enhanced Performance: Optimized for high-bandwidth and low-latency applications, making it suitable for a wide range of industries including telecommunications, automotive, and data processing.
This device is ideal for applications requiring a balance of performance, flexibility, and power efficiency.

Package

The XC7K325T-3FFG900E is packaged in a Fine-Pitch Ball Grid Array (FBGA) format, specifically with 900 balls. This type of package is designed for high-density applications, providing excellent thermal performance and reduced footprint.

Pinout

The XC7K325T-3FFG900E is a field-programmable gate array (FPGA) from Xilinx's Kintex-7 series. It features a total of 900 pins.
Key functions of the XC7K325T-3FFG900E include:
1. Logic Resources: It contains 325,000 logic cells, enabling complex logic designs.
2. DSP Slices: Designed for high-performance signal processing, it includes DSP slices suitable for digital signal processing applications.
3. Memory: Offers integrated block RAM and support for various memory interfaces.
4. I/O Capabilities: Supports a variety of I/O standards and configurations, allowing for flexibility in interfacing with other components.
5. Processing Performance: Optimized for low power consumption while providing high-speed performance, making it suitable for a range of applications including communications, automotive, and industrial systems.
Overall, its pin configuration and feature set make it suitable for diverse applications that require high processing capabilities and flexibility.

Manufacturer

The manufacturer of the XC7K325T-3FFG900E is Xilinx, Inc., which is a semiconductor company known for its programmable logic devices. Xilinx specializes in Field-Programmable Gate Arrays (FPGAs), Complex Programmable Logic Devices (CPLDs), and software design tools for these devices. Founded in 1984, the company has been a leader in the development of reconfigurable computing technologies, allowing engineers and developers to create custom hardware solutions for a wide range of applications, including telecommunications, automotive, aerospace, and consumer electronics. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its position in the semiconductor market.

Application

The XC7K325T-3FFG900E is a Xilinx Kintex-7 FPGA used in various applications, including telecommunications, data processing, video and image processing, automotive systems, industrial automation, and aerospace. Its high-performance capabilities make it suitable for real-time processing, signal processing, and as a platform for prototyping and implementing complex algorithms in embedded systems.

Equivalent

The XC7K325T-3FFG900E is a Xilinx Kintex-7 FPGA. Equivalent products include the Lattice ECP5-5G, Intel/Altera Arria 10 GX, and Xilinx Artix-7 series FPGAs, depending on specific application requirements such as logic density, performance, and features. Always verify compatibility based on the targeted application.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

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Actualmente, solo aceptamos los siguientes métodos de pago:

1. de PayPal

2. Tarjeta de crédito/débito

3. Transferencia bancaria

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