XC7K325T-2FFG900C

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XC7K325T-2FFG900C

IC FPGA 500 I/O 900FCBGA

  • Fabricante
  • Mfr. Parte #XC7K325T-2FFG900C
  • Paquete FBGA-900
  • Hoja de datos
  • En stock7107

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Especificaciones

Package Tray
Series Kintex®-7
ProductStatus Active
NumberofLABs/CLBs 25475
NumberofLogicElements/Cells 326080
TotalRAMBits 16404480
NumberofI/O 500
Voltage-Supply 0.97V ~ 1.03V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 900-BBGA, FCBGA

Descripción general

Description

The XC7K325T-2FFG900C is a Field-Programmable Gate Array (FPGA) from Xilinx's Kintex-7 family, designed for high-performance applications. It features 325,000 logic cells, making it suitable for complex digital designs. The device operates at a maximum clock frequency of 450 MHz and supports various I/O standards, allowing for versatile connectivity options.
This FPGA is built on a 28nm process technology, offering improved power efficiency and performance compared to its predecessors. It includes a rich set of resources, such as digital signal processing (DSP) slices, block RAM, and high-speed transceivers, enabling it to efficiently handle tasks ranging from signal processing to data communications.
The XC7K325T-2FFG900C comes in a 900-pin FFG package, providing ample I/O and power options for extensive applications in automotive, telecommunications, and industrial automation. It is programmable via HDL languages such as VHDL and Verilog, allowing designers to create custom hardware solutions tailored to specific requirements. Overall, this FPGA balances performance, cost, and power efficiency, making it an ideal choice for modern digital design challenges.

Features

The XC7K325T-2FFG900C is a field-programmable gate array (FPGA) from Xilinx's Kintex-7 series. Key features include:
- Logic Cells: 325,000 logic cells, providing significant processing power for complex computations.
- DSP Slices: 720 DSP slices for high-performance digital signal processing.
- Memory: 18Mb of on-chip RAM, supporting large data handling and storage capabilities.
- IO Pins: Up to 300 I/O pins, supporting various I/O standards including LVDS, LVCMOS, and more.
- Speed Grade: -2 speed grade, offering a balance between performance and power efficiency.
- Power Consumption: Low static and dynamic power, suitable for power-sensitive applications.
- Serial Connectivity: Integrated high-speed transceivers (up to 12.5 Gbps) for high-bandwidth communications.
- Configuration Options: Multiple configuration methods, including JTAG and SPI.
This FPGA is ideal for applications in telecommunications, industrial automation, and data processing due to its flexibility and performance.

Package

The XC7K325T-2FFG900C is packaged in a FFG (Fine Pitch Flip Chip) 900-ball grid array (BGA) format. This package type allows for a high pin count and efficient thermal management, making it suitable for high-performance applications in FPGAs.

Pinout

The XC7K325T-2FFG900C is a member of the Xilinx Kintex-7 FPGA family. It features a total of 900 pins. The device has multiple I/O banks and supports a variety of functions, including general-purpose I/O (GPIO), high-speed transceivers, and specialized interfaces such as PCIe, Ethernet, and UART.
In addition to its extensive I/O capabilities, it includes configurable logic blocks for implementing custom logic functions, digital signal processing (DSP) slices for arithmetic operations, and block RAM for memory storage. It is designed to provide high performance and low power consumption, making it suitable for applications in telecommunications, automotive, and industrial sectors.

Manufacturer

The XC7K325T-2FFG900C is manufactured by Xilinx, Inc., a leading company in the field of programmable logic devices and FPGAs (Field-Programmable Gate Arrays). Xilinx specializes in providing advanced semiconductor solutions for a variety of applications, including communications, automotive, aerospace, industrial, and data centers. The company is known for its innovative products that enable designers to create highly customizable and efficient hardware solutions. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further expanding AMD's portfolio in the high-performance computing domain.

Application

The XC7K325T-2FFG900C is a Xilinx Kintex-7 FPGA ideal for high-performance applications such as digital signal processing, communications, video processing, industrial automation, and aerospace. It is utilized in system-on-chip (SoC) designs, embedded systems, and as an accelerator for data centers due to its flexibility, high logic density, and efficient power consumption. Its advanced features also support high-speed serial interfaces and complex algorithms, making it suitable for both research and commercial projects.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

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