XC7K325T-2FBG900C

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XC7K325T-2FBG900C

IC FPGA 500 I/O 900FCBGA

  • Fabricante
  • Mfr. Parte #XC7K325T-2FBG900C
  • Paquete BGA900
  • Hoja de datos
  • En stock7221

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Especificaciones

Package Tray
Series Kintex®-7
ProductStatus Active
NumberofLABs/CLBs 25475
NumberofLogicElements/Cells 326080
TotalRAMBits 16404480
NumberofI/O 500
Voltage-Supply 0.97V ~ 1.03V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 900-BBGA, FCBGA

Descripción general

Description

The XC7K325T-2FBG900C is a Field Programmable Gate Array (FPGA) from Xilinx's Kintex-7 series. It features a moderate capacity of 325,000 logic cells, making it suitable for a variety of applications, including digital signal processing, communications, and embedded systems.
Key specifications include a maximum clock frequency of up to 450 MHz, a rich set of I/O options, and integrated high-speed transceivers. This FPGA operates on a 28nm process technology, which enhances performance while reducing power consumption.
The device comes in a BGA (Ball Grid Array) package with 900 pins, offering flexibility in design for complex applications. It supports various development environments, including Vivado Design Suite, which provides tools for synthesis, place and route, and simulation.
Overall, the XC7K325T-2FBG900C is ideal for engineers looking to implement high-performance and customizable hardware solutions in their projects.

Features

The XC7K325T-2FBG900C is a Field Programmable Gate Array (FPGA) from Xilinx's Kintex-7 series. Key features include:
- Logic Cells: 325,000 logic cells, providing substantial processing capabilities.
- DSP Slices: 840 DSP slices, optimized for high-performance digital signal processing.
- Memory: 18Mb of block RAM, allowing for efficient data storage and access.
- I/O Ports: Up to 450 I/O pins with multi-standard support, accommodating various interfaces.
- Transceivers: Up to 16 high-speed transceivers supporting up to 6.6 Gbps, facilitating fast data communication.
- Power Consumption: Lower power consumption compared to previous generations, enhancing energy efficiency.
- Configuration: Configurable via JTAG, SPI, or other methods, allowing flexibility in deployment.
- Applications: Suitable for a wide range of applications, including communications, automotive, and industrial control systems.
This FPGA is ideal for engineers looking for a balance of performance, flexibility, and cost in their designs.

Package

The XC7K325T-2FBG900C is packaged in a FBG (Fine Pitch Ball Grid Array) format, specifically with a 900-ball configuration. This package type provides a compact design with excellent thermal and electrical performance, suitable for high-density applications in FPGAs.

Pinout

The XC7K325T-2FBG900C is a Field Programmable Gate Array (FPGA) from Xilinx’s Kintex-7 series. It features a total of 900 pins.
The functions of the pins include:
- I/O Pins: Configurable as inputs or outputs for general-purpose digital signaling.
- Power Pins: Supply various voltage levels for core and I/O operations.
- Global Clock Pins: Dedicated pins for distributing clock signals across the FPGA for synchronous operation.
- Configuration Pins: Used to configure the FPGA upon power-up or during operation.
- JTAG Pins: For boundary scan and programming the device.
- Dedicated Serial Communication Pins: For high-speed serial interfaces like SPI or LVDS.
This versatile pinout supports a wide range of applications in digital design, ranging from communication systems to signal processing.

Manufacturer

The XC7K325T-2FBG900C is manufactured by Xilinx, Inc., a leading company in the semiconductor industry. Xilinx specializes in field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and adaptive computing solutions. Founded in 1984, Xilinx has played a significant role in the development of programmable logic technology, enabling engineers to create custom hardware solutions for a wide range of applications, including telecommunications, automotive, aerospace, defense, and industrial automation. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further expanding its capabilities and market reach.

Application

The XC7K325T-2FBG900C is a Xilinx Kintex-7 FPGA commonly used in applications such as digital signal processing, telecommunications, video and image processing, automotive systems, aerospace and defense, industrial automation, and high-performance computing. Its capabilities make it suitable for high-speed data handling, real-time processing, and complex algorithm implementation across various industries.

Equivalent

The XC7K325T-2FBG900C is a Xilinx Kintex-7 FPGA. Equivalent products include:
1. XC7K325T-1FBG900C - Similar features but a different speed grade.
2. XC7K410T-2FBG900C - Higher logic cell count.
3. Lattice ECP5 - A competitive FPGA family with similar performance.
4. Altera Cyclone V - Another alternative with comparable specifications.
Always verify compatibility for specific applications.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

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Actualmente, solo aceptamos los siguientes métodos de pago:

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2. Tarjeta de crédito/débito

3. Transferencia bancaria

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