XC7K325T-1FFG900C

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XC7K325T-1FFG900C

IC FPGA 500 I/O 900FCBGA

  • Fabricante
  • Mfr. Parte #XC7K325T-1FFG900C
  • Paquete BGA-900
  • Hoja de datos
  • En stock5146

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Especificaciones

Package Tray
Series Kintex®-7
ProductStatus Active
NumberofLABs/CLBs 25475
NumberofLogicElements/Cells 326080
TotalRAMBits 16404480
NumberofI/O 500
Voltage-Supply 0.97V ~ 1.03V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 900-BBGA, FCBGA

Descripción general

Description

The XC7K325T-1FFG900C is a Field-Programmable Gate Array (FPGA) from Xilinx's Kintex-7 family. It features a 325,000 logic cell capacity and is designed for high-performance applications requiring a balance of speed and power efficiency. Built on a 28nm process technology, it offers enhanced processing capabilities with a maximum clock frequency of around 450 MHz.
Key features include:
- Logic Cells: 325,000, providing substantial processing power for complex designs.
- Configurable I/O: Supports various I/O standards, including LVDS, providing versatility in connectivity.
- Digital Signal Processing (DSP) Blocks: It contains advanced DSP slices, ideal for signal processing applications.
- Memory Interfaces: Supports high-speed memory interfaces, crucial for data-intensive applications.
- Power Management: Designed with power efficiency in mind, making it suitable for embedded applications.
The XC7K325T is well-suited for applications in aerospace, communications, automotive, and industrial sectors, allowing for custom hardware implementations tailored to specific performance requirements.

Features

The XC7K325T-1FFG900C is a Field Programmable Gate Array (FPGA) from Xilinx's Kintex-7 series. Key features include:
- Logic Cells: 325,000 system logic cells
- DSP Slices: 840 18x25 DSP slices for high-performance digital signal processing
- Memory: Up to 18 Mbits of block RAM
- I/O Capabilities: Supports up to 600 user I/O pins with various I/O standards
- Transceiver: Up to 16 GTP transceivers for high-speed serial connectivity (up to 6.6 Gbps)
- Power Efficiency: Designed for low power consumption while delivering high performance
- Configuration Options: Supports various configuration methods, including JTAG and SPI
- Embedded Features: Includes support for advanced embedded processing with soft processors and hard IP cores.
The XC7K325T-1FFG900C is suitable for applications in telecommunications, industrial automation, and high-performance computing.

Package

The XC7K325T-1FFG900C is packaged in a FFG (Fine Pitch Ball Grid Array) format with 900 balls. It is designed for high-density applications and provides excellent thermal performance and signal integrity.

Pinout

The XC7K325T-1FFG900C is a Field-Programmable Gate Array (FPGA) from Xilinx's Kintex-7 series. It features a pin count of 900. The device is designed for high-performance applications and offers a variety of functionalities including digital signal processing, communication, and data processing tasks.
Key functions of the XC7K325T-1FFG900C include:
1. Logic Cells: Approximately 325,000 logic cells for configurable logic operations.
2. DSP Slices: Around 840 DSP slices for efficient arithmetic processing.
3. Memory: Integrated block RAM (BRAM) for data storage and processing.
4. I/O Ports: Configurable I/O pins supporting various voltage standards and communication protocols.
5. Clock Management: Built-in clock management capabilities for handling high-speed operations.
This FPGA is suitable for applications in areas such as telecommunications, aerospace, and automotive systems.

Manufacturer

The XC7K325T-1FFG900C is manufactured by Xilinx, Inc., a semiconductor company known for its field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and system-on-a-chip (SoC) solutions. Xilinx, founded in 1984, is recognized for pioneering the FPGA technology, allowing users to configure hardware functionalities post-manufacture. The company's products are widely used in various applications, including telecommunications, automotive, aerospace, and industrial automation. Xilinx focuses on providing high-performance and adaptive computing solutions, enabling customers to implement advanced digital designs efficiently. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its capabilities in the semiconductor industry.

Application

The XC7K325T-1FFG900C is a versatile FPGA from Xilinx's Kintex-7 series, commonly used in various applications, including telecommunications, data processing, automotive systems, medical devices, aerospace, industrial automation, and video processing. Its high-performance capabilities and parallel processing make it suitable for tasks like digital signal processing, embedded computing, and custom hardware acceleration.

Equivalent

The XC7K325T-1FFG900C is a Xilinx Kintex-7 FPGA. Equivalent products include other Kintex-7 variants like XC7K325T-2FFG900C (higher speed grade) and XC7K325T-1FFG676C (different package). Additionally, products from competing families, such as Intel's Arria 10 or Lattice's ECP5 series, may serve similar applications but will require design adaptation. Always verify compatibility for specific use cases.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

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