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XC6SLX9-2FTG256I
IC FPGA 186 I/O 256FTBGA
- Fabricante
- Mfr. Parte #XC6SLX9-2FTG256I
- Paquete FBGA-256
- Hoja de datos
- En stock4034
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Especificaciones
| Package | Tray |
| Series | Spartan®-6 LX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 715 |
| NumberofLogicElements/Cells | 9152 |
| TotalRAMBits | 589824 |
| NumberofI/O | 186 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 256-LBGA |
Descripción general
Description
Key specifications include a maximum clock frequency of 400 MHz, support for multiple I/O standards, and integrated DSP slices for efficient signal processing. The device is housed in a 256-pin Fine Pitch BGA (FTG) package, facilitating easy integration into compact circuit designs.
The XC6SLX9 also supports a wide range of development tools and languages, such as VHDL and Verilog, allowing for flexible design and implementation. Its balance of performance and power efficiency makes it an excellent choice for applications requiring moderate complexity and high reliability.
Features
- Logic Cells: 9,152 logic cells with 4-input LUTs.
- I/O Pins: Up to 92 user-defined I/O pins.
- Embedded Memory: 576 Kbits of distributed RAM and 2.4 Mbits of block RAM.
- DSP Slices: 26 dedicated DSP slices for efficient signal processing.
- Configuration: Supports various configuration modes including JTAG and SPI.
- Power Consumption: Low power operation, ideal for portable applications.
- Temperature Range: Industrial grade, suitable for extended temperature applications.
- Package: Available in a 256-ball FG484 package.
This FPGA is suitable for applications in communications, automotive, industrial control, and consumer electronics, providing a balance of performance, power efficiency, and flexibility.
Package
Pinout
This specific model operates at a maximum clock frequency of 200 MHz and offers up to 9,152 logic cells. It includes various I/O configurations, supporting multiple voltage standards, and has integrated DSP slices and block RAM for efficient data handling.
The "FTG256" package indicates a Fine Pitch Ball Grid Array (FBGA) with 256 balls, while the "I" suffix denotes that the chip is industrial-grade, suitable for extended temperature ranges. The Spartan-6 family is known for its low power consumption and flexibility, making it a popular choice for embedded applications.
Manufacturer
Application
Equivalent
1. Lattice ECP5: Similar density and features.
2. Intel (Altera) Cyclone IV or V: Comparable performance and I/O capabilities.
3. Microsemi (Microchip) SmartFusion II: Offers similar functionality with ARM Cortex-M3.
When selecting an equivalent, consider specific requirements like power consumption, I/O count, and application needs. Always verify compatibility with design tools and libraries.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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