XC6SLX75-3FGG676C

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XC6SLX75-3FGG676C

IC FPGA 408 I/O 676FBGA

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  • Mfr. Parte #XC6SLX75-3FGG676C
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Especificaciones

Series Spartan®-6 LX
Part Status Active
Base Product Number XC6SLX75
DigiKey Programmable Not Verified
Number of LABs/CLBs 5831
Number of Logic Elements/Cells 74637
Total RAM Bits 3170304
Number of I/O 408
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package 676-BGA
Supplier Device Package 676-FBGA (27x27)
Packaging Tray

Descripción general

Description

The XC6SLX75-3FGG676C is a field-programmable gate array (FPGA) from Xilinx's Spartan-6 family. It features 75,000 logic cells and is designed for cost-sensitive applications that require moderate performance. The "3" indicates the speed grade, which determines the maximum operating frequency; in this case, it offers a balanced performance for various tasks.
With 676 pins in a Fine-Pitch Ball Grid Array (FBGA) package, it provides ample I/O flexibility. The device supports various interfaces, including PCI Express, SPI, and I2C, making it versatile for different applications such as communication, automotive, and consumer electronics.
The XC6SLX75 integrates advanced features like DSP slices for digital signal processing tasks, block RAM, and support for multiple voltage levels. It is programmable using VHDL or Verilog, allowing for customization according to the specific needs of a project. The Spartan-6 series emphasizes low power consumption while maintaining reliable performance, making it suitable for both prototyping and production environments.

Features

The XC6SLX75-3FGG676C is a Spartan-6 FPGA (Field Programmable Gate Array) from Xilinx. It features:
- Logic Cells: 75,000 logic cells, enabling complex digital logic designs.
- DSP Slices: Up to 48 DSP slices for high-performance digital signal processing.
- Memory: 4.9 Mb of Block RAM for efficient data storage and retrieval.
- I/O Pins: 676 I/O pins, supporting various interfaces and protocols.
- Speed Grade: -3 speed grade, offering a balance of performance and power consumption.
- Power Consumption: Low power operation, making it suitable for battery-powered applications.
- Configurable Logic Blocks (CLBs): Contains configurable blocks for user-defined logic.
- Integrated Clock Management: Built-in Clock Management Tiles (CMTs) for efficient clock distribution.
- Protocols Support: Supports various communication protocols, including PCIe and Ethernet.
- Development Tools: Compatible with Xilinx ISE design suite for development and debugging.
This FPGA is ideal for applications in automotive, industrial control, telecommunications, and more, due to its flexibility and performance.

Package

The XC6SLX75-3FGG676C is packaged in a Fine-Pitch Ball Grid Array (FBGA) configuration with 676 balls. It features a compact design suitable for high-density applications in various electronic systems.

Pinout

The XC6SLX75-3FGG676C is a part of the Xilinx Spartan-6 FPGA family. It features a pin count of 676. This FPGA is designed for low-power applications, offering a balance of performance and efficiency. The device includes a range of I/O banks, support for various I/O standards, and integrated block RAM, DSP slices, and configuration options that facilitate diverse applications in communications, automotive, industrial, and consumer electronics.
The 3 in the part number indicates the speed grade, which influences the operating frequency and power consumption. The FGG package type signifies a Fine Pitch Ball Grid Array (FBGA) with a thermal rating suitable for high-performance applications. Overall, the XC6SLX75-3FGG676C is well-suited for a variety of digital design tasks requiring flexibility and processing capabilities.

Manufacturer

The manufacturer of the XC6SLX75-3FGG676C is Xilinx, Inc. Xilinx is a semiconductor company known for developing programmable logic devices, including field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and software tools for design and development. Founded in 1984, the company played a pioneering role in the FPGA industry, offering solutions that allow engineers to design custom hardware for a wide range of applications, from telecommunications and automotive to aerospace and industrial automation. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its capabilities in the high-performance computing market.

Application

The XC6SLX75-3FGG676C is a low-power, versatile FPGA used in various application areas, including telecommunications, industrial automation, automotive systems, aerospace, and medical devices. It is ideal for digital signal processing, video processing, and embedded systems due to its high performance and flexibility. Additionally, it supports applications in networking equipment, consumer electronics, and IoT devices, enabling rapid prototyping and custom hardware acceleration.

Equivalent

The XC6SLX75-3FGG676C is a Xilinx Spartan-6 FPGA. Equivalent products include the XC6SLX75-3FGG676, XC6SLX75-2FGG676, and other similar Spartan-6 models (like XC6SLX50 or XC6SLX100) with varying logic cell counts and speed grades. For alternatives from other manufacturers, consider devices like Altera's Cyclone IV series or Lattice's ECP3 series, depending on specific application requirements. Always check compatibility with the design specifications.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

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