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XC6SLX75-3FGG676C
IC FPGA 408 I/O 676FBGA
- Fabricante
- Mfr. Parte #XC6SLX75-3FGG676C
- Paquete
- Hoja de datos
- En stock5426
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Especificaciones
| Series | Spartan®-6 LX |
| Part Status | Active |
| Base Product Number | XC6SLX75 |
| DigiKey Programmable | Not Verified |
| Number of LABs/CLBs | 5831 |
| Number of Logic Elements/Cells | 74637 |
| Total RAM Bits | 3170304 |
| Number of I/O | 408 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | 676-BGA |
| Supplier Device Package | 676-FBGA (27x27) |
| Packaging | Tray |
Descripción general
Description
With 676 pins in a Fine-Pitch Ball Grid Array (FBGA) package, it provides ample I/O flexibility. The device supports various interfaces, including PCI Express, SPI, and I2C, making it versatile for different applications such as communication, automotive, and consumer electronics.
The XC6SLX75 integrates advanced features like DSP slices for digital signal processing tasks, block RAM, and support for multiple voltage levels. It is programmable using VHDL or Verilog, allowing for customization according to the specific needs of a project. The Spartan-6 series emphasizes low power consumption while maintaining reliable performance, making it suitable for both prototyping and production environments.
Features
- Logic Cells: 75,000 logic cells, enabling complex digital logic designs.
- DSP Slices: Up to 48 DSP slices for high-performance digital signal processing.
- Memory: 4.9 Mb of Block RAM for efficient data storage and retrieval.
- I/O Pins: 676 I/O pins, supporting various interfaces and protocols.
- Speed Grade: -3 speed grade, offering a balance of performance and power consumption.
- Power Consumption: Low power operation, making it suitable for battery-powered applications.
- Configurable Logic Blocks (CLBs): Contains configurable blocks for user-defined logic.
- Integrated Clock Management: Built-in Clock Management Tiles (CMTs) for efficient clock distribution.
- Protocols Support: Supports various communication protocols, including PCIe and Ethernet.
- Development Tools: Compatible with Xilinx ISE design suite for development and debugging.
This FPGA is ideal for applications in automotive, industrial control, telecommunications, and more, due to its flexibility and performance.
Package
Pinout
The 3 in the part number indicates the speed grade, which influences the operating frequency and power consumption. The FGG package type signifies a Fine Pitch Ball Grid Array (FBGA) with a thermal rating suitable for high-performance applications. Overall, the XC6SLX75-3FGG676C is well-suited for a variety of digital design tasks requiring flexibility and processing capabilities.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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