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XC6SLX75-2FGG676I
IC FPGA 408 I/O 676FBGA
- Fabricante
- Mfr. Parte #XC6SLX75-2FGG676I
- Paquete BGA676
- Hoja de datos
- En stock6612
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Especificaciones
| Package | Tray |
| Series | Spartan®-6 LX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 5831 |
| NumberofLogicElements/Cells | 74637 |
| TotalRAMBits | 3170304 |
| NumberofI/O | 408 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 676-BGA |
Descripción general
Description
This specific model features 75,000 logic cells, offering a balance of logic resources, I/O capabilities, and memory. The "2" in the designation refers to its speed grade, indicating moderate speed performance. The "FGG" package indicates a fine-pitch ball grid array, suitable for compact designs, and "676" represents the number of pins.
Applications include consumer electronics, automotive systems, and industrial automation, where low power consumption and flexibility in design are crucial. The Spartan-6 series supports various interfaces and protocols, making it versatile for numerous digital design projects. Additionally, it is programmable using Xilinx's ISE software tools, facilitating development and deployment in various embedded systems.
Features
1. Logic Cells: It contains 75,000 logic cells, enabling complex designs and high performance.
2. DSP Slices: The device includes 48 DSP slices, ideal for digital signal processing applications.
3. Memory: It provides 4.9 Mbits of embedded block RAM (BRAM) for efficient on-chip data storage.
4. I/O Capabilities: Features up to 232 user I/O pins with flexible I/O standards, supporting high-speed data transfer.
5. Power Efficiency: Designed for low power consumption, making it suitable for battery-operated devices.
6. Configuration Options: Supports multiple configuration modes, including JTAG and SPI.
7. Package Type: Housed in a 676-pin FGG package, offering a compact form factor for diverse applications.
Overall, the XC6SLX75-2FGG676I is ideal for cost-sensitive applications requiring performance and versatility, such as automotive, consumer electronics, and industrial automation.
Package
Pinout
The FPGA is designed for applications in consumer electronics, automotive, and industrial markets, providing a balance of performance and power efficiency. With its architecture, it supports multiple configurations and can handle various tasks in parallel, making it suitable for both complex and simple designs.
Manufacturer
Application
Equivalent
1. XC6SLX75-3FGG676I - Higher speed grade.
2. XC6SLX75-2CSG484I - Different package type.
3. Lattice ECP3-70 - Similar performance and features.
4. Altera Cyclone IV EP4CE75F23C7N - Comparable FPGA in performance.
Check specifications for compatibility with your application.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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