XC6SLX75-2FGG676C

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XC6SLX75-2FGG676C

IC FPGA 408 I/O 676FBGA

  • Fabricante
  • Mfr. Parte #XC6SLX75-2FGG676C
  • Paquete 676-BGA
  • Hoja de datos
  • En stock7362

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Especificaciones

Supplier AMD Xilinx
Package Tray
Series Spartan®-6 LX
ProductStatus Active
NumberofLABs/CLBs 5831
NumberofLogicElements/Cells 74637
TotalRAMBits 3170304
NumberofI/O 408
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 676-BGA

Descripción general

Description

XC6SLX75-2FGG676C is a Xilinx Spartan-6 FPGA device. It belongs to the LX75 density tier in the Spartan-6 family, with a -2 speed grade for moderate performance. The FG676C package denotes a FineLine BGA with 676 balls and a Commercial (0–85°C) temperature rating.
Highlights:
- Mid-range FPGA with programmable logic, DSP slices, and block RAM
- Many I/O pins across multiple banks for peripherals and interfaces
- Suitable for digital logic, DSP, embedded interfaces, and cost/power-conscious designs
For exact resources (logic cells, LUTs, BRAM/DSP blocks, I/O count, timing, and power), refer to the official Xilinx datasheet and user guide for XC6SLX75 and the FG676C package.

Features

XC6SLX75-2FGG676C is a Spartan-6 LX75 FPGA in a FG676 676-pin BGA. Key features (high level):
- Spartan-6 LX family: low-cost, low-power FPGA for general logic and DSP.
- Density: around 75K logic cells (logic elements).
- Package: FG676 ball-grid array with many user I/O pins.
- Speed grade: -2.
- On-chip resources: BRAM (block RAM) and distributed RAM for memory needs; DSP slices for high-speed arithmetic.
- Clocking: clock management tiles with PLLs for flexible timing.
- I/O: multiple I/O banks with 3.3V (and some banks selectable for other voltages) I/O; ample I/O to support dense designs.
- Configuration and security: support for standard config interfaces (JTAG/SPI) and non-volatile bitstream storage.
- Power and temperature: optimized for lower power and commercial temperature range.
Note: For exact counts (BRAM, DSP slice counts, I/O per bank, etc.) and detailed electrical specs, please consult the Xilinx datasheet for XC6SLX75-2FGG676C.

Package

FineLine Ball Grid Array (FineLine BGA) package — FGG676 (676-ball).

Pinout

- Pin count: 676 pins (FGG676 package)
- Function: Xilinx Spartan-6 LX75 FPGA (field-programmable gate array) used for programmable logic with LUTs/FFs, block RAM, DSP slices, and I/O.

Manufacturer

- Manufacturer: Xilinx, Inc.
- What kind of company: An American semiconductor company that designs programmable logic devices (FPGAs/CPLDs); a fabless semiconductor company that outsources manufacturing.

Application

XC6SLX75-2FGG676C is a Spartan-6 LX75 FPGA. Suitable application areas include:
- Digital signal processing and embedded control (real-time processing, motor control, filtering)
- Communications and networking (high-speed serial interfaces, protocol bridges, data path acceleration)
- Video, image processing and multimedia engines
- Data acquisition, instrumentation, test & measurement equipment
- Industrial automation and automotive electronics (sensor interfacing, control logic)
- Prototyping, development boards and education/low-cost embedded systems

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FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

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