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XC6SLX75-2FGG484I
IC FPGA 280 I/O 484FBGA
- Fabricante
- Mfr. Parte #XC6SLX75-2FGG484I
- Paquete BGA-484
- Hoja de datos
- En stock5099
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Especificaciones
| Package | Tray |
| Series | Spartan®-6 LX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 5831 |
| NumberofLogicElements/Cells | 74637 |
| TotalRAMBits | 3170304 |
| NumberofI/O | 280 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 484-BBGA |
Descripción general
Description
The “2” in the part number indicates a specific speed grade, while “FGG484” denotes the package type and size, which is a fine-pitch ball grid array (FBGA) with 484 balls. The device is optimized for low power consumption, making it suitable for battery-operated devices and portable applications. Additionally, it includes built-in digital signal processing (DSP) capabilities, making it effective for signal processing tasks.
The XC6SLX75-2FGG484I's combination of performance, power efficiency, and programmability makes it a popular choice in industries such as telecommunications, automotive, and consumer electronics.
Features
- Logic Cells: Up to 75,000 logic cells for complex designs.
- Configurable I/O: 484-pin package with versatile I/O capabilities, supporting various voltage standards.
- Memory: Embedded block RAM (BRAM) up to 4.5 Mbits for high-performance memory storage.
- DSP Slices: Up to 48 DSP slices for efficient signal processing.
- Power Efficiency: Optimized for low power consumption, ideal for battery-operated devices.
- High-Speed Transceivers: Supports up to 1 Gbps serial connectivity options.
- Development Tools: Compatible with Xilinx ISE design suite for easy implementation and debugging.
- Temperature Range: Available in industrial-grade versions for extended temperature ranges.
This FPGA is suitable for a wide range of applications, including communications, automotive, industrial automation, and consumer electronics.
Package
Pinout
The device includes multiple I/O banks, each capable of supporting various voltage levels and offering different I/O standards. It also features integrated resources such as logic cells, DSP slices, and block RAM for efficient processing and data handling. The specific functions of the pins include general-purpose I/O, configuration, power supply, and ground connections, among others.
This FPGA is optimized for low power consumption while providing high performance, making it suitable for applications requiring flexibility and efficiency.
Manufacturer
Application
Equivalent
1. LatticeECP3: Specifically, models like LFE3-70EA or LFE3-70E.
2. Altera Cyclone III: Cyclone III EP3C75F484C6N.
3. Microsemi SmartFusion: SmartFusion2 devices with comparable logic resources.
Check specific datasheets for detailed feature comparisons and compatibility.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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