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XC6SLX45-2CSG324C
IC FPGA 218 I/O 324CSBGA
- Fabricante
- Mfr. Parte #XC6SLX45-2CSG324C
- Paquete BGA-324
- Hoja de datos
- En stock2475
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Especificaciones
| Package | Tray |
| Series | Spartan®-6 LX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 3411 |
| NumberofLogicElements/Cells | 43661 |
| TotalRAMBits | 2138112 |
| NumberofI/O | 218 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 324-LFBGA, CSPBGA |
Descripción general
Description
This specific model comes in a CSG324 package, which provides 324 pins and is suitable for both surface mount and through-hole applications. With an internal configuration memory, it allows for flexible design implementations and can be programmed using various hardware description languages.
The XC6SLX45-2CSG324C also includes built-in support for digital signal processing (DSP) blocks, block RAM, and a rich set of I/O options, making it particularly valuable for applications requiring high performance with low power consumption. Its balance of features, performance, and cost makes it a popular choice among engineers and developers in the FPGA space.
Features
1. Logic Cells: 45,000 logic cells enabling complex designs.
2. DSP Slices: Integrated DSP blocks for high-performance signal processing.
3. Memory: Up to 2.2 Mb of distributed RAM and 512 Kb of block RAM.
4. I/O Pins: 48 user-configurable I/O pins that support various standards.
5. Clock Management: Enhanced clock management capabilities with clock dividers and phase-locked loops (PLLs).
6. Power: Low power operation with a typical supply voltage of 1.2V.
7. Package: Available in a compact 324-ball CSG (Chip Scale Grid Array) package.
8. Development Support: Compatible with Xilinx ISE design suite for development and implementation.
This FPGA is suitable for applications in automotive, industrial, and consumer electronics where performance and efficiency are crucial.
Package
Pinout
The pins of the XC6SLX45-2CSG324C serve various functions, including:
1. I/O Pins: Configurable as input or output for general data transfer.
2. Dedicated Clock Pins: For clock signals to synchronize operations.
3. Configuration Pins: Used for programming the FPGA.
4. Power Pins: Supply voltage (VCC) and ground (GND) connections.
5. High-Speed Transceivers: Supporting high-speed communication protocols.
The FPGA supports multiple I/O standards and can be configured for various applications, including digital signal processing, communications, and control systems. Its versatility and performance make it suitable for a wide range of designs.
Manufacturer
Application
Equivalent
1. Lattice ECP5 - Offers comparable performance and density.
2. Altera Cyclone IV - Similar features but different architecture.
3. Microsemi IGLOO2 - Low-power alternative with FPGA capabilities.
Consider specific application requirements (I/O, power, performance) when selecting an alternative.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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