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XC6SLX25T-2CSG324I
IC FPGA 190 I/O 324CSBGA
- Fabricante
- Mfr. Parte #XC6SLX25T-2CSG324I
- Paquete CSBGA-324
- Hoja de datos
- En stock2774
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Especificaciones
| Package | Tray |
| Series | Spartan®-6 LXT |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1879 |
| NumberofLogicElements/Cells | 24051 |
| TotalRAMBits | 958464 |
| NumberofI/O | 190 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 324-LFBGA, CSPBGA |
Descripción general
Description
The "T" designation indicates that it is a temperature-grade device suitable for commercial environments. The "2" signifies the speed grade, with lower numbers indicating faster performance. The package type "CSG324" refers to a 324-ball Chip-on-Glass package, which aids in compact designs.
Key features include programmable logic blocks, DSP slices for digital signal processing, and various I/O standards. Spartan-6 devices are commonly used in applications such as consumer electronics, automotive systems, and telecommunications, owing to their balance of cost, power efficiency, and capability. The XC6SLX25T is particularly noted for its ease of use, supported by Xilinx's development tools, which facilitate efficient design and implementation processes.
Features
- Logic Cells: 25,000 logic cells for versatile design capabilities.
- DSP Slices: Supports digital signal processing with 4 DSP slices for efficient arithmetic operations.
- Memory: Up to 1.5 Mbits of distributed RAM and up to 1 Mbit of Block RAM for data storage.
- I/O Pins: 24 configurable I/O pins with support for various voltage levels and standards, enabling broad connectivity.
- Power Consumption: Optimized for low power operation, making it suitable for battery-operated devices.
- Configuration: Supports multiple configuration methods, including JTAG and SPI.
- Speed Grade: Speed grade of -2, providing a good balance between performance and power usage.
This FPGA is widely used in applications ranging from automotive to consumer electronics and industrial automation, thanks to its flexibility and robust feature set.
Package
Pinout
The primary functions of this FPGA include digital logic implementation, signal processing, and interfacing with various peripherals. It is designed for applications such as communications, automotive, industrial control, and consumer electronics. The FPGA offers programmable logic resources, including configurable logic blocks (CLBs), digital signal processing (DSP) slices, and memory blocks, allowing users to customize the hardware to meet specific application requirements. The "I" in its designation indicates that it is rated for industrial temperature operation, suitable for more demanding environments.
Manufacturer
Application
Equivalent
1. Intel (Altera) Cyclone IV EP4CE22F23C8N
2. Lattice ECP5 LFE5U-25F-7BG381C
3. Microsemi SmartFusion2 M2S010
4. Xilinx Spartan-6 variants like XC6SLX25T-3CSG324I (different speed grade).
Compatibility may vary based on specific requirements such as I/O, power, and performance.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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