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XC3S700AN-4FGG484C
IC FPGA 372 I/O 484FBGA
- Fabricante
- Mfr. Parte #XC3S700AN-4FGG484C
- Paquete
- Hoja de datos
- En stock2726
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Especificaciones
| Series | Spartan®-3AN |
| Part Status | Obsolete |
| Base Product Number | XC3S700 |
| DigiKey Programmable | Not Verified |
| Number of LABs/CLBs | 1472 |
| Number of Logic Elements/Cells | 13248 |
| Total RAM Bits | 368640 |
| Number of I/O | 372 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | 484-BBGA |
| Supplier Device Package | 484-FBGA (23x23) |
| Packaging | Tray |
| Number of Gates | 700000 |
Descripción general
Description
Key specifications include a maximum clock speed of up to 200 MHz, support for multiple I/O voltage standards, and abundant on-chip resources such as logic cells, block RAM, and digital signal processing (DSP) slices. The XC3S700AN is particularly well-suited for applications in telecommunications, automotive systems, and consumer electronics, where cost-effectiveness and low power consumption are essential.
Its programmable nature allows developers to customize hardware functionality after manufacturing, making it an ideal choice for prototyping and iterative design. The device is supported by Xilinx's development tools, including the ISE Design Suite, facilitating ease of use in design and implementation processes.
Features
1. Logic Cells: Approximately 700,000 system gates for implementing complex logic functions.
2. I/O Pins: 484 pins with up to 226 user I/Os, supporting various I/O standards including LVTTL, LVCMOS, and SSTL.
3. Memory: Includes 40 Kbits of distributed RAM and up to 4 Mbits of block RAM for data storage.
4. DSP Slices: Contains up to 32 DSP slices for efficient digital signal processing tasks.
5. Clock Management: Features a clock management tile (CMT) that includes a phase-locked loop (PLL) for clock generation and distribution.
6. Power: Low power consumption, making it suitable for battery-operated devices.
7. Configuration: Supports multiple configuration options, including JTAG and SPI.
The XC3S700AN is ideal for applications in communications, automotive, and industrial control systems, offering flexibility for custom hardware implementations.
Package
Pinout
The functions of these pins include:
1. I/O Pins: Configurable for various logic levels, allowing for digital input and output.
2. Dedicated Clock Inputs: For clock signals to synchronize operations within the FPGA.
3. Configuration Pins: Used for programming the FPGA during the configuration phase.
4. Power Supply Pins: Provide power to the FPGA.
5. GND Pins: Connect to ground to complete the circuit.
6. JTAG Pins: For debugging and programming the FPGA.
The architecture of the XC3S700AN supports a variety of applications, including digital signal processing, communication systems, and embedded processing, due to its flexibility and reconfigurability.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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