XC3S700AN-4FGG484C

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XC3S700AN-4FGG484C

IC FPGA 372 I/O 484FBGA

  • Fabricante
  • Mfr. Parte #XC3S700AN-4FGG484C
  • Paquete
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  • En stock2726

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Especificaciones

Series Spartan®-3AN
Part Status Obsolete
Base Product Number XC3S700
DigiKey Programmable Not Verified
Number of LABs/CLBs 1472
Number of Logic Elements/Cells 13248
Total RAM Bits 368640
Number of I/O 372
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package 484-BBGA
Supplier Device Package 484-FBGA (23x23)
Packaging Tray
Number of Gates 700000

Descripción general

Description

The XC3S700AN-4FGG484C is a Field-Programmable Gate Array (FPGA) from Xilinx's Spartan-3A series, designed for versatility in various applications. It features 700,000 system gates, offering a balance of performance and power efficiency. The device is housed in a 484-pin Fine Pitch Ball Grid Array (FBGA) package, allowing for a compact design.
Key specifications include a maximum clock speed of up to 200 MHz, support for multiple I/O voltage standards, and abundant on-chip resources such as logic cells, block RAM, and digital signal processing (DSP) slices. The XC3S700AN is particularly well-suited for applications in telecommunications, automotive systems, and consumer electronics, where cost-effectiveness and low power consumption are essential.
Its programmable nature allows developers to customize hardware functionality after manufacturing, making it an ideal choice for prototyping and iterative design. The device is supported by Xilinx's development tools, including the ISE Design Suite, facilitating ease of use in design and implementation processes.

Features

The XC3S700AN-4FGG484C is a field-programmable gate array (FPGA) from Xilinx's Spartan-3A series. Key features include:
1. Logic Cells: Approximately 700,000 system gates for implementing complex logic functions.
2. I/O Pins: 484 pins with up to 226 user I/Os, supporting various I/O standards including LVTTL, LVCMOS, and SSTL.
3. Memory: Includes 40 Kbits of distributed RAM and up to 4 Mbits of block RAM for data storage.
4. DSP Slices: Contains up to 32 DSP slices for efficient digital signal processing tasks.
5. Clock Management: Features a clock management tile (CMT) that includes a phase-locked loop (PLL) for clock generation and distribution.
6. Power: Low power consumption, making it suitable for battery-operated devices.
7. Configuration: Supports multiple configuration options, including JTAG and SPI.
The XC3S700AN is ideal for applications in communications, automotive, and industrial control systems, offering flexibility for custom hardware implementations.

Package

The XC3S700AN-4FGG484C is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically with 484 balls. This type of package offers high-density interconnections and is suitable for applications requiring compact design and efficient thermal performance.

Pinout

The XC3S700AN-4FGG484C is a field-programmable gate array (FPGA) from Xilinx's Spartan-3A family. It has a total of 484 pins.
The functions of these pins include:
1. I/O Pins: Configurable for various logic levels, allowing for digital input and output.
2. Dedicated Clock Inputs: For clock signals to synchronize operations within the FPGA.
3. Configuration Pins: Used for programming the FPGA during the configuration phase.
4. Power Supply Pins: Provide power to the FPGA.
5. GND Pins: Connect to ground to complete the circuit.
6. JTAG Pins: For debugging and programming the FPGA.
The architecture of the XC3S700AN supports a variety of applications, including digital signal processing, communication systems, and embedded processing, due to its flexibility and reconfigurability.

Manufacturer

The XC3S700AN-4FGG484C is manufactured by Xilinx, Inc. Xilinx is a semiconductor company known for designing and producing programmable logic devices, including field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and system-on-chip (SoC) solutions. Founded in 1984, the company is a pioneer in the FPGA market and provides solutions for a wide range of applications, including telecommunications, automotive, industrial, and consumer electronics. Xilinx was acquired by Advanced Micro Devices (AMD) in 2020, further expanding its portfolio in the semiconductor industry.

Application

The XC3S700AN-4FGG484C is a Spartan-3A FPGA commonly used in applications such as digital signal processing, video and image processing, communication systems, industrial automation, automotive systems, and embedded systems. Its flexibility and reconfigurability make it suitable for prototyping, hardware acceleration, and implementing custom algorithms in various electronic designs.

Equivalent

The XC3S700AN-4FGG484C is a Spartan-3A FPGA. Equivalent products include the XC3S700A series FPGAs, such as the XC3S700A-4FGG484C, as well as similar FPGAs from other families like the Lattice ECP3 or Altera Cyclone III, depending on specific requirements like I/O counts and performance. Always verify compatibility with your application specifications.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

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