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XC3S700A-4FGG484I
IC FPGA 372 I/O 484FBGA
- Fabricante
- Mfr. Parte #XC3S700A-4FGG484I
- Paquete FCBGA-484
- Hoja de datos
- En stock4187
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Especificaciones
| Package | Tray |
| Series | Spartan®-3A |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1472 |
| NumberofLogicElements/Cells | 13248 |
| TotalRAMBits | 368640 |
| NumberofI/O | 372 |
| NumberofGates | 700000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 484-BBGA |
Descripción general
Description
The “-4” denotes the speed grade, indicating that this particular FPGA operates at a moderate speed. The “FGG484” package indicates a fine-pitch ball grid array (FBGA) with 484 balls, allowing for a compact design that is ideal for space-constrained applications. Additionally, the “I” suffix indicates the industrial temperature range, ensuring the FPGA can operate reliably in harsher environments.
The XC3S700A is commonly used in applications such as communications, automotive, defense, and consumer electronics, providing flexibility in design and the ability to implement complex algorithms and custom logic on demand.
Features
1. Logic Cells: Approximately 700,000 system gates with 4-input look-up tables (LUTs) and flip-flops.
2. I/O Pins: 484-ball grid array (BGA) package with up to 232 I/O pins, supporting various I/O standards.
3. Memory: Integrated block RAM (BRAM) with 36 Kbit configurations, allowing for efficient data storage.
4. DSP Slices: Up to 24 DSP slices for high-performance signal processing applications.
5. Clock Management: Equipped with phase-locked loops (PLLs) for flexible clock management.
6. Power Efficiency: Low power consumption, suitable for battery-operated devices.
7. Development Support: Compatible with Xilinx ISE Design Suite for design and implementation.
Overall, the XC3S700A-4FGG484I offers a balance of performance, flexibility, and power efficiency, making it ideal for a wide range of digital design applications.
Package
Pinout
The primary functions of the XC3S700A include digital signal processing, logic design, and hardware acceleration for various applications. It supports a range of I/O standards and offers flexibility in programming, allowing for custom logic implementations. The device is suitable for applications in communications, automotive, industrial control, and consumer electronics due to its balance of performance, power efficiency, and integration capabilities.
The "4" in the designation indicates its speed grade, while "FGG" refers to the package type (Fine Pitch Ball Grid Array). The "I" at the end denotes the industrial temperature grade, indicating it operates effectively in a wider temperature range.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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