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XC3S500E-4FTG256I
IC FPGA 190 I/O 256FTBGA
- Fabricante
- Mfr. Parte #XC3S500E-4FTG256I
- Paquete BGA-256
- Hoja de datos
- En stock7626
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Especificaciones
| Package | Tray |
| Series | Spartan®-3E |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1164 |
| NumberofLogicElements/Cells | 10476 |
| TotalRAMBits | 368640 |
| NumberofI/O | 190 |
| NumberofGates | 500000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 256-LBGA |
Descripción general
Description
This FPGA includes 256 I/O pins, enabling extensive connectivity options, and supports various I/O standards like LVTTL and LVCMOS. It operates on a voltage range of 1.2V to 3.3V, making it energy-efficient. The XC3S500E is ideal for applications in telecommunications, automotive, consumer electronics, and industrial control due to its flexibility and reprogrammability.
The device is packaged in a fine-pitch ball grid array (FBGA) format, allowing for compact designs. Additionally, it is supported by Xilinx's development tools, such as ISE and Vivado, which facilitate the design, simulation, and implementation processes. Overall, the XC3S500E-4FTG256I delivers a combination of performance, scalability, and cost-effectiveness for a wide range of digital applications.
Features
1. Logic Cells: It contains up to 500,000 system gates and 2,304 logic cells, providing ample processing power for various applications.
2. Embedded Memory: Supports up to 18 Kbit of block RAM, enabling efficient data storage and manipulation.
3. I/O Performance: Offers up to 70 user-programmable I/O pins, with support for various I/O standards (e.g., LVTTL, LVCMOS).
4. DSP Slices: Includes DSP slices for efficient digital signal processing capabilities.
5. Configurable Logic Blocks (CLBs): Features a flexible architecture for implementing combinatorial and sequential logic functions.
6. Low Power Consumption: Designed for low power operation, making it suitable for battery-operated devices.
7. Development Support: Compatible with Xilinx development tools like ISE, facilitating design and programming.
These features make the XC3S500E-4FTG256I suitable for applications in consumer electronics, automotive, and industrial automation.
Package
Pinout
The device operates at a maximum speed grade of -4 and is packaged in a Fine Pitch Ball Grid Array (FBGA) format (FTG256). The functionality of the XC3S500E includes a variety of digital logic capabilities, including configurable logic blocks (CLBs), digital signal processing (DSP) slices, and memory resources. It supports various I/O standards, making it suitable for numerous applications in areas such as communications, automotive, and industrial control.
Additionally, it provides features like embedded multipliers, block RAM, and a rich set of I/O pins for interfacing with other components, allowing for extensive customization and flexibility in design.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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