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XC3S500E-4FTG256C
IC FPGA 190 I/O 256FTBGA
- Fabricante
- Mfr. Parte #XC3S500E-4FTG256C
- Paquete BGA-256
- Hoja de datos
- En stock7010
100% original & Nuevo
24 horas listos para el envío
Garantía de 365 días
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Especificaciones
| Package | Tray |
| Series | Spartan®-3E |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1164 |
| NumberofLogicElements/Cells | 10476 |
| TotalRAMBits | 368640 |
| NumberofI/O | 190 |
| NumberofGates | 500000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 256-LBGA |
Descripción general
Description
Key specifications include a 256-ball Thin Fine Pitch Ball Grid Array (TFBGA) package, operating voltage of 3.3V, and a maximum clock frequency of up to 200 MHz. The device supports multiple I/O standards and provides flexible interfacing options, enabling integration with various peripherals.
It is particularly favored in applications such as automotive, industrial control, and consumer electronics due to its balance of performance, power efficiency, and cost-effectiveness. The XC3S500E also benefits from Xilinx's comprehensive development tools, including the ISE Design Suite, which aids in design, simulation, and programming. Overall, it's an ideal choice for engineers looking to implement custom digital circuits in a versatile and scalable manner.
Features
1. Logic Cells: It has 500,000 system gates and offers a significant number of configurable logic blocks (CLBs) for versatile design capabilities.
2. I/O Pins: 256 available I/O pins, supporting various I/O standards for flexible interfacing.
3. Memory: Integrated block RAM (BRAM) with a total of 18 Kbits per block, allowing efficient data storage and processing.
4. DSP Blocks: Includes dedicated DSP slices for high-performance digital signal processing applications.
5. Configuration: Support for multiple configuration modes, including JTAG and serial configurations.
6. Power Efficiency: Designed for low power consumption, making it suitable for battery-operated applications.
7. Operating Voltage: Typically operates at 1.2V core voltage with I/O voltage options ranging from 1.2V to 3.3V.
The XC3S500E is ideal for a wide range of applications, including embedded systems, communications, and consumer electronics.
Package
Pinout
Key functional specifics include:
- Configurable Logic Blocks (CLBs): Used for implementing combinational and sequential logic.
- I/O Blocks: Supports multiple I/O standards, allowing for interfacing with other digital components.
- Dedicated DSP Slices: For high-performance digital signal processing tasks.
- Memory: Contains block RAM for data storage.
- Clock Management: Features clock management tiles for efficient clock distribution.
This FPGA is particularly suited for applications in consumer electronics, automotive, and industrial control systems where integration and performance are crucial.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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