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XC3S400A-4FTG256I
IC FPGA 195 I/O 256FTBGA
- Fabricante
- Mfr. Parte #XC3S400A-4FTG256I
- Paquete FBGA-256
- Hoja de datos
- En stock4924
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Especificaciones
| Package | Tray |
| Series | Spartan®-3A |
| ProductStatus | Active |
| NumberofLABs/CLBs | 896 |
| NumberofLogicElements/Cells | 8064 |
| TotalRAMBits | 368640 |
| NumberofI/O | 195 |
| NumberofGates | 400000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 256-LBGA |
Descripción general
Description
This FPGA operates at a maximum clock frequency of 250 MHz and offers versatile I/O options with support for various voltage levels, allowing integration with different systems. The device is housed in a 256-pin Fine Pitch Ball Grid Array (FBGA) package, facilitating compact designs.
Key features include a powerful architecture with integrated memory blocks, efficient power consumption, and programmable interconnects, enabling users to optimize their designs for performance and resource efficiency. The XC3S400A also supports advanced design tools like Xilinx ISE, facilitating easier development and deployment of complex algorithms and functions. Overall, it provides a flexible platform for engineers to implement innovative solutions in various applications.
Features
1. Logic Cells: It contains 400,000 system gates and offers around 12,000 logic cells.
2. I/O Pins: Equipped with 256 I/O pins, supporting multiple voltage standards.
3. Performance: Provides a maximum performance of 250 MHz and low power consumption.
4. Memory: Includes embedded block RAM (up to 18 Kb per block) and digital signal processing (DSP) capabilities.
5. Configuration: Supports various configuration methods, including JTAG and Serial.
6. Development Tools: Compatible with Xilinx ISE software for design implementation and simulation.
7. Package: Available in a Fine-Pitch Ball Grid Array (FBGA) package for efficient thermal and electrical performance.
8. Applications: Ideal for a range of applications, including telecommunications, automotive, and industrial control systems.
Overall, the XC3S400A-4FTG256I balances performance, flexibility, and power efficiency for diverse design requirements.
Package
Pinout
The functions of the pins on this FPGA include:
1. I/O Pins: Used for general-purpose input and output operations.
2. Configuration Pins: For loading configuration data into the FPGA.
3. Power Pins: Provide the necessary voltage levels for the FPGA operation.
4. Clock Pins: For external clock input signals.
5. Dedicated High-Speed Interface Pins: Used for specific protocols and high-speed communication.
6. Ground Pins: For electrical grounding.
This FPGA is commonly used in various applications such as digital signal processing, communications, and embedded systems due to its flexibility and reconfigurability.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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